Reliability challenges in 3D IC packaging technology - Tu, K.N. (Microelectronics and reliability, 2011)
Keywords: Applied sciences; Design. Technologies. Operation analysis. Testing; Electromigration; Electronics; Exact sciences and technology; Integrated circuits; Microelectronics; Packaging; Projection; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Temperature gradient; Thermomigration; Three dimensional; Thermal diffusion; Interconnection; Electronic packaging; Integrated circuit; Flip-chip; Electrodiffusion; Microelectronics; Reliability; Joule effect; Temperature gradient