Cooling thermal parameters, microstructure, segregation and hardness in directionally solidified Al–Sn-(Si;Cu) alloys
[Display omitted] •Experimental dendritic growth laws are proposed for solidification of Al–Sn-(Cu;Si) alloys.•The Sn distribution is characterized by inverse macrosegregation profiles.•Hall–Petch type equations are proposed relating the primary dendritic arm spacing to hardness. The morphology and...
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Published in | Materials & Design Vol. 72; pp. 31 - 42 |
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Main Authors | , , , , , , , |
Format | Journal Article |
Language | English |
Published |
Elsevier Ltd
05.05.2015
Elsevier |
Subjects | |
Online Access | Get full text |
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