Cooling thermal parameters, microstructure, segregation and hardness in directionally solidified Al–Sn-(Si;Cu) alloys

[Display omitted] •Experimental dendritic growth laws are proposed for solidification of Al–Sn-(Cu;Si) alloys.•The Sn distribution is characterized by inverse macrosegregation profiles.•Hall–Petch type equations are proposed relating the primary dendritic arm spacing to hardness. The morphology and...

Full description

Saved in:
Bibliographic Details
Published inMaterials & Design Vol. 72; pp. 31 - 42
Main Authors Bertelli, Felipe, Brito, Crystopher, Ferreira, Ivaldo L., Reinhart, Guillaume, Nguyen-Thi, Henri, Mangelinck-Noël, Nathalie, Cheung, Noé, Garcia, Amauri
Format Journal Article
LanguageEnglish
Published Elsevier Ltd 05.05.2015
Elsevier
Subjects
Online AccessGet full text

Cover

Loading…