Construction of 3D Skeleton for Polymer Composites Achieving a High Thermal Conductivity

• Published in: Small (Weinheim an der Bergstrasse, Germany) Vol. 14; no. 13; pp. e1704044 - n/a
• Main Authors: Yao, Yimin, Sun, Jiajia, Zeng, Xiaoliang, Sun, Rong, Xu, Jian‐Bin, Wong, Ching‐Ping
• Format: Journal Article
• Language: English
• Published: Germany Wiley Subscription Services, Inc 01.03.2018
• Subjects: Boron nitride; Boron-epoxy composites; Electronic devices; Heat conductivity; Heat transfer; ice‐templated assembly; Nanotechnology; phonon skeleton; Platelets; polymer composites; Polymer matrix composites; Polymers; Thermal conductivity; Thermal management; Three dimensional composites; boron nitride; ice-templated assembly; thermal conductivity; polymer composites; phonon skeleton

Owing to the growing heat removal issue in modern electronic devices, electrically insulating polymer composites with high thermal conductivity have drawn much attention during the past decade. However, the conventional method to improve through‐plane thermal conductivity of these polymer composites...