Indentation creep of lead-free Sn–9Zn and Sn–8Zn–3Bi solder alloys

• Published in: Materials in engineering Vol. 30; no. 3; pp. 574 - 580
• Main Authors: Mahmudi, R., Geranmayeh, A.R., Khanbareh, H., Jahangiri, N.
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01.03.2009
• Subjects: E.Creep; Mechanical; E.Creep; Mechanical

Creep behavior of Sn–9%Zn and Sn–8%Zn–3%Bi solders together with Sn–37% Pb, as the material for comparison, was studied by indentation tests at room-temperature ( T > 0.6 T m) in order to evaluate the correspondence of the creep results obtained by different methods of analysis, and to evaluate t...