Effect of rapid solidification on mechanical properties of a lead free Sn–3.5Ag solder

• Published in: Journal of alloys and compounds Vol. 505; no. 1; pp. 113 - 117
• Main Author: Shalaby, R.M.
• Format: Journal Article
• Language: English
• Published: Kidlington Elsevier B.V 27.08.2010; Elsevier
• Subjects: Alloys; Condensed matter: structure, mechanical and thermal properties; Creep; Deformation and plasticity (including yield, ductility, and superplasticity); Eutectic composition; Exact sciences and technology; Lead free; Lead free solder; Mechanical and acoustical properties; Mechanical and acoustical properties of condensed matter; Mechanical properties; Mechanical properties of solids; Melt spinning; Melting point; Physical properties of thin films, nonelectronic; Physics; Rapid solidification; Solders; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties); Tensile properties; Tin; Zinc; Lead free solder; Mechanical properties; Rapid solidification; Melting point; Tensile properties; Intermetallic compounds; Creep; Ternary alloys; Dispersions; Tin alloys; Eutectics; Bismuth; Eutectic alloys; Soldered joints; Grain size; Binary systems; Indium additions; Melting points; Precipitates; Zinc; Solidification; Binary alloys; Silver; Fractures; Spinning

The melt-spinning processes of Sn–3.5Ag, Sn–3.5Ag–2In, Sn–3.5Ag–2Bi and Sn–3.5Ag–2Zn lead free solders were investigated and analyzed. The results showed that formation of intermetallic compounds of ɛ-Ag 3Sn, In 0.2Sn 0.8 and AgZn embedded in Sn matrix phase, were produced during melt-spinning techn...