Thermal and optical performance characterization of bare and phosphor converted LEDs through package level immersion cooling
•Opto-thermal enhancements of package level immersion cooling are extensively studied.•Both thermal resistance reduction and power conversion improvements were observed.•Liquid encapsulation method is reliable and leak free.•Millimeter scale immersion results in a conduction dominant heat removal re...
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| Published in | International journal of heat and mass transfer Vol. 189; p. 122607 |
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| Main Authors | , , |
| Format | Journal Article |
| Language | English |
| Published |
Oxford
Elsevier Ltd
15.06.2022
Elsevier BV |
| Subjects | |
| Online Access | Get full text |
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| Abstract | •Opto-thermal enhancements of package level immersion cooling are extensively studied.•Both thermal resistance reduction and power conversion improvements were observed.•Liquid encapsulation method is reliable and leak free.•Millimeter scale immersion results in a conduction dominant heat removal regime.
Increased demand for high flux electronics requires creative and affordable thermal management approaches to meet the performance and lifetime expectations. In the present study, optical and thermal improvements of a new package level liquid coolant encapsulation that directly targets heat generation zones are studied for bare and phosphor converted LEDs. As heat both at chip and phosphor composite regions are being generated, a series of detailed experimental and theoretical characterization is performed in order to examine the capability of the new cooling method. The findings can be used to extend the application of precisely controlled liquid packing on the heat source region of optoelectronic components. This method has shown a 15% reduction in thermal resistance and a 7% increase in power conversion efficiency of LED packages. The capacity of this method is mainly limited to the thermal conductivity of the coolant while a significant ability for improvement can be expected by utilizing thermally conductive particles such as hexagonal boron nitride inside the coolant. |
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| AbstractList | Increased demand for high flux electronics requires creative and affordable thermal management approaches to meet the performance and lifetime expectations. In the present study, optical and thermal improvements of a new package level liquid coolant encapsulation that directly targets heat generation zones are studied for bare and phosphor converted LEDs. As heat both at chip and phosphor composite regions are being generated, a series of detailed experimental and theoretical characterization is performed in order to examine the capability of the new cooling method. The findings can be used to extend the application of precisely controlled liquid packing on the heat source region of optoelectronic components. This method has shown a 15% reduction in thermal resistance and a 7% increase in power conversion efficiency of LED packages. The capacity of this method is mainly limited to the thermal conductivity of the coolant while a significant ability for improvement can be expected by utilizing thermally conductive particles such as hexagonal boron nitride inside the coolant. •Opto-thermal enhancements of package level immersion cooling are extensively studied.•Both thermal resistance reduction and power conversion improvements were observed.•Liquid encapsulation method is reliable and leak free.•Millimeter scale immersion results in a conduction dominant heat removal regime. Increased demand for high flux electronics requires creative and affordable thermal management approaches to meet the performance and lifetime expectations. In the present study, optical and thermal improvements of a new package level liquid coolant encapsulation that directly targets heat generation zones are studied for bare and phosphor converted LEDs. As heat both at chip and phosphor composite regions are being generated, a series of detailed experimental and theoretical characterization is performed in order to examine the capability of the new cooling method. The findings can be used to extend the application of precisely controlled liquid packing on the heat source region of optoelectronic components. This method has shown a 15% reduction in thermal resistance and a 7% increase in power conversion efficiency of LED packages. The capacity of this method is mainly limited to the thermal conductivity of the coolant while a significant ability for improvement can be expected by utilizing thermally conductive particles such as hexagonal boron nitride inside the coolant. |
| ArticleNumber | 122607 |
| Author | Cengiz, Ceren Azarifar, Mohammad Arik, Mehmet |
| Author_xml | – sequence: 1 givenname: Mohammad surname: Azarifar fullname: Azarifar, Mohammad organization: EVATEG Center, College of Engineering, Ozyegin University, Istanbul, Turkey – sequence: 2 givenname: Ceren orcidid: 0000-0003-4420-4171 surname: Cengiz fullname: Cengiz, Ceren organization: EVATEG Center, College of Engineering, Ozyegin University, Istanbul, Turkey – sequence: 3 givenname: Mehmet surname: Arik fullname: Arik, Mehmet email: mehmet.arik@ozyegin.edu.tr organization: EVATEG Center, College of Engineering, Ozyegin University, Istanbul, Turkey |
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| Snippet | •Opto-thermal enhancements of package level immersion cooling are extensively studied.•Both thermal resistance reduction and power conversion improvements were... Increased demand for high flux electronics requires creative and affordable thermal management approaches to meet the performance and lifetime expectations. In... |
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| SubjectTerms | Boron nitride Coolants Electronics packaging Energy conversion efficiency Heat generation Heat transfer Immersion cooling LED Liquid cooling Optoelectronics Optoelectronics thermal management Packaging Phosphors SSL Thermal conductivity Thermal management Thermal resistance |
| Title | Thermal and optical performance characterization of bare and phosphor converted LEDs through package level immersion cooling |
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