Nano-indentation characterization of Ni–Cu–Sn IMC layer subject to isothermal aging

• Published in: Thin solid films Vol. 504; no. 1; pp. 362 - 366
• Main Authors: Xu, Luhua, Pang, John H.L.
• Format: Journal Article Conference Proceeding
• Language: English
• Published: Lausanne Elsevier B.V 10.05.2006; Elsevier Science
• Subjects: Condensed matter: structure, mechanical and thermal properties; Cross-disciplinary physics: materials science; rheology; Elastic modulus; Elasticity, elastic constants; Exact sciences and technology; Intermetallic compound; Materials science; Mechanical and acoustical properties of condensed matter; Mechanical properties of solids; Nanoindentation CSM; Physics; SnAgCu lead-free solder; Surface treatments; Transport properties of condensed matter (nonelectronic); Tribology and hardness; Elastic modulus; SnAgCu lead-free solder; Intermetallic compound; Nanoindentation CSM; Thermal diffusion; Inorganic compounds; Nickel alloys; Intermetallic compounds; Nanoindentation; Polishing; Hardness; Experimental study; Interfaces; Young modulus; Tin alloys; Copper alloys; Growth mechanism; Aging; Reliability; Crystal morphology; Soldered joints; Transition element alloys; Crystal structure

Lead-free Sn–Ag–Cu(SAC) solder joint on Cu–OSP and ENIG subject to thermal testing leads to IMC growth and causes corresponding reliability concerns at the interface. Modulus and hardness of these IMCs were characterized by Nanoindentation CSM from plan view in this study. A plan-view IMC surface wa...