Nano-indentation characterization of Ni–Cu–Sn IMC layer subject to isothermal aging - Xu, Luhua; Pang, John H.L. (Thin solid films, 2006)
Keywords: Condensed matter: structure, mechanical and thermal properties; Cross-disciplinary physics: materials science; rheology; Elastic modulus; Elasticity, elastic constants; Exact sciences and technology; Intermetallic compound; Materials science; Mechanical and acoustical properties of condensed matter; Mechanical properties of solids; Nanoindentation CSM; Physics; SnAgCu lead-free solder; Surface treatments; Transport properties of condensed matter (nonelectronic); Tribology and hardness; Elastic modulus; SnAgCu lead-free solder; Intermetallic compound; Nanoindentation CSM; Thermal diffusion; Inorganic compounds; Nickel alloys; Intermetallic compounds; Nanoindentation; Polishing; Hardness; Experimental study; Interfaces; Young modulus; Tin alloys; Copper alloys; Growth mechanism; Aging; Reliability; Crystal morphology; Soldered joints; Transition element alloys; Crystal structure