APA (7th ed.) Citation

Xu, L., & Pang, J. H. (2006). Nano-indentation characterization of Ni–Cu–Sn IMC layer subject to isothermal aging. Thin solid films, 504(1), 362-366. https://doi.org/10.1016/j.tsf.2005.09.056

Chicago Style (17th ed.) Citation

Xu, Luhua, and John H.L Pang. "Nano-indentation Characterization of Ni–Cu–Sn IMC Layer Subject to Isothermal Aging." Thin Solid Films 504, no. 1 (2006): 362-366. https://doi.org/10.1016/j.tsf.2005.09.056.

MLA (9th ed.) Citation

Xu, Luhua, and John H.L Pang. "Nano-indentation Characterization of Ni–Cu–Sn IMC Layer Subject to Isothermal Aging." Thin Solid Films, vol. 504, no. 1, 2006, pp. 362-366, https://doi.org/10.1016/j.tsf.2005.09.056.