Regeneration of Sn-Pb solder from waste printed circuit boards: A hydrometallurgical approach to treating waste with waste
[Display omitted] •Cementation can be used to reproduce the Sn-Pb solder from waste PCB.•The reproduced solder has negligible concentrations of chemical impurities.•Thermodynamic and kinetics modeling was employed to determine the reaction mechanism.•With a melting point of ∼185 °C, reproduced solde...
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| Published in | Journal of hazardous materials Vol. 385; p. 121589 |
|---|---|
| Main Authors | , , , |
| Format | Journal Article |
| Language | English |
| Published |
Netherlands
Elsevier B.V
05.03.2020
|
| Subjects | |
| Online Access | Get full text |
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| Abstract | [Display omitted]
•Cementation can be used to reproduce the Sn-Pb solder from waste PCB.•The reproduced solder has negligible concentrations of chemical impurities.•Thermodynamic and kinetics modeling was employed to determine the reaction mechanism.•With a melting point of ∼185 °C, reproduced solder can be used in electronic industries.•Very low electrical resistivity confirmed the high quality of reproduced solder.
A green approach was introduced to regenerate Sn-Pb solder from waste printed circuit boards (PCBs). For this purpose, waste Al-based heat sinks were used as cementing agent to precipitate Sn and Pb from pregnant leach solution (PLS) obtained from the dissolution of waste PCBs in HCl. 97 % and 94.9 % of Sn and Pb were recovered, respectively, under optimum conditions at Al powder size of 300 μm, Al dosage of 1.516 g/l and reaction time of 15.41 min. Thermodynamic analysis was performed to predict the effect of temperature on the main reactions relevant to the cementation process. The structure of the Sn-Pb cement changed as function of temperature, leading to enhancement of the cementation rate via improving cathodic area. Kinetic modeling indicates that product layer diffusion is the rate limiting step for Sn and Pb cementation. However, the reaction mechanism shifted to chemical reaction control at high temperatures. The results of solder characterization indicated that the melting point of solder was 184.76 °C. The electrical resistivity and conductivity of the recovered pure alloy were measured to be 34.73 μΩ-cm and 2.88 × 106 Sm−1, respectively. The characterization revealed that the regenerated product is adequate as an alternative solder alloy. |
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| AbstractList | A green approach was introduced to regenerate Sn-Pb solder from waste printed circuit boards (PCBs). For this purpose, waste Al-based heat sinks were used as cementing agent to precipitate Sn and Pb from pregnant leach solution (PLS) obtained from the dissolution of waste PCBs in HCl. 97 % and 94.9 % of Sn and Pb were recovered, respectively, under optimum conditions at Al powder size of 300 μm, Al dosage of 1.516 g/l and reaction time of 15.41 min. Thermodynamic analysis was performed to predict the effect of temperature on the main reactions relevant to the cementation process. The structure of the Sn-Pb cement changed as function of temperature, leading to enhancement of the cementation rate via improving cathodic area. Kinetic modeling indicates that product layer diffusion is the rate limiting step for Sn and Pb cementation. However, the reaction mechanism shifted to chemical reaction control at high temperatures. The results of solder characterization indicated that the melting point of solder was 184.76 °C. The electrical resistivity and conductivity of the recovered pure alloy were measured to be 34.73 μΩ-cm and 2.88 × 10
Sm
, respectively. The characterization revealed that the regenerated product is adequate as an alternative solder alloy. [Display omitted] •Cementation can be used to reproduce the Sn-Pb solder from waste PCB.•The reproduced solder has negligible concentrations of chemical impurities.•Thermodynamic and kinetics modeling was employed to determine the reaction mechanism.•With a melting point of ∼185 °C, reproduced solder can be used in electronic industries.•Very low electrical resistivity confirmed the high quality of reproduced solder. A green approach was introduced to regenerate Sn-Pb solder from waste printed circuit boards (PCBs). For this purpose, waste Al-based heat sinks were used as cementing agent to precipitate Sn and Pb from pregnant leach solution (PLS) obtained from the dissolution of waste PCBs in HCl. 97 % and 94.9 % of Sn and Pb were recovered, respectively, under optimum conditions at Al powder size of 300 μm, Al dosage of 1.516 g/l and reaction time of 15.41 min. Thermodynamic analysis was performed to predict the effect of temperature on the main reactions relevant to the cementation process. The structure of the Sn-Pb cement changed as function of temperature, leading to enhancement of the cementation rate via improving cathodic area. Kinetic modeling indicates that product layer diffusion is the rate limiting step for Sn and Pb cementation. However, the reaction mechanism shifted to chemical reaction control at high temperatures. The results of solder characterization indicated that the melting point of solder was 184.76 °C. The electrical resistivity and conductivity of the recovered pure alloy were measured to be 34.73 μΩ-cm and 2.88 × 106 Sm−1, respectively. The characterization revealed that the regenerated product is adequate as an alternative solder alloy. |
| ArticleNumber | 121589 |
| Author | Soltani, Faraz Tavakoli Mohammadi, Mohammad Reza Ghassa, Sina Moosakazemi, Farhad |
| Author_xml | – sequence: 1 givenname: Farhad surname: Moosakazemi fullname: Moosakazemi, Farhad organization: Beneficiation and Hydrometallurgy Research Group, Mineral Processing Research Center, Academic Center for Education, Culture and Research (ACECR) on TMU, Tehran, Iran – sequence: 2 givenname: Sina surname: Ghassa fullname: Ghassa, Sina organization: School of Mining, College of Engineering, University of Tehran, Tehran, 16846-13114, Iran – sequence: 3 givenname: Faraz orcidid: 0000-0003-1631-9836 surname: Soltani fullname: Soltani, Faraz email: faraz.soltani@arakut.ac.ir organization: Department of Mining Engineering, Arak University of Technology, Markazi, Iran – sequence: 4 givenname: Mohammad Reza surname: Tavakoli Mohammadi fullname: Tavakoli Mohammadi, Mohammad Reza organization: Beneficiation and Hydrometallurgy Research Group, Mineral Processing Research Center, Academic Center for Education, Culture and Research (ACECR) on TMU, Tehran, Iran |
| BackLink | https://www.ncbi.nlm.nih.gov/pubmed/31735471$$D View this record in MEDLINE/PubMed |
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| Copyright | 2019 Elsevier B.V. Copyright © 2019 Elsevier B.V. All rights reserved. |
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| Keywords | Regeneration Sn-Pb solder Recycling Waste PCBs Cementation |
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•Cementation can be used to reproduce the Sn-Pb solder from waste PCB.•The reproduced solder has negligible concentrations of chemical... A green approach was introduced to regenerate Sn-Pb solder from waste printed circuit boards (PCBs). For this purpose, waste Al-based heat sinks were used as... |
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| SubjectTerms | Cementation Recycling Regeneration Sn-Pb solder Waste PCBs |
| Title | Regeneration of Sn-Pb solder from waste printed circuit boards: A hydrometallurgical approach to treating waste with waste |
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