Electrochemical investigation of copper passivation kinetics and its application to low-pressure CMP modeling

• Published in: Applied surface science Vol. 265; pp. 764 - 770
• Main Authors: Li, Jing, Liu, Yuhong, Wang, Tongqing, Lu, Xinchun, Luo, Jianbin
• Format: Journal Article
• Language: English
• Published: Amsterdam Elsevier B.V 15.01.2013; Elsevier
• Subjects: CHARGING; CONNECTORS (ELECTRICAL); Copper; Copper passivation kinetics; Cross-disciplinary physics: materials science; rheology; CURRENT DENSITY; Decay; Double layer; Exact sciences and technology; HIGH VACUUM; KINETICS; Low -pressure CMP; Materials science; MICA; PASSIVATION; Physics; Reaction kinetics; Surface treatments; Ultra Large Scale Integration; Model; Copper passivation kinetics; Low -pressure CMP; Planarization; Low-pressure CMP; Transition elements; Modelling; Kinetics; Copper; Passivation

▸ The copper passivation kinetics is studied by the chronoamperometry technique. ▸ A model based on the passivation kinetics is proposed for low-pressure CMP. ▸ The mechanical effect dominates the material removal at pH 4. ▸ It is a chemical dominant process at pH 10 during low-pressure CMP. During...