Electrochemical investigation of copper passivation kinetics and its application to low-pressure CMP modeling - Li, Jing; Liu, Yuhong; Wang, Tongqing; Lu, Xinchun; Luo, Jianbin (Applied surface science, 2013)
Keywords: CHARGING; CONNECTORS (ELECTRICAL); Copper; Copper passivation kinetics; Cross-disciplinary physics: materials science; rheology; CURRENT DENSITY; Decay; Double layer; Exact sciences and technology; HIGH VACUUM; KINETICS; Low -pressure CMP; Materials science; MICA; PASSIVATION; Physics; Reaction kinetics; Surface treatments; Ultra Large Scale Integration; Model; Copper passivation kinetics; Low -pressure CMP; Planarization; Low-pressure CMP; Transition elements; Modelling; Kinetics; Copper; Passivation