APA (7th ed.) Citation

Li, J., Liu, Y., Wang, T., Lu, X., & Luo, J. (2013). Electrochemical investigation of copper passivation kinetics and its application to low-pressure CMP modeling. Applied surface science, 265, 764-770. https://doi.org/10.1016/j.apsusc.2012.11.106

Chicago Style (17th ed.) Citation

Li, Jing, Yuhong Liu, Tongqing Wang, Xinchun Lu, and Jianbin Luo. "Electrochemical Investigation of Copper Passivation Kinetics and Its Application to Low-pressure CMP Modeling." Applied Surface Science 265 (2013): 764-770. https://doi.org/10.1016/j.apsusc.2012.11.106.

MLA (9th ed.) Citation

Li, Jing, et al. "Electrochemical Investigation of Copper Passivation Kinetics and Its Application to Low-pressure CMP Modeling." Applied Surface Science, vol. 265, 2013, pp. 764-770, https://doi.org/10.1016/j.apsusc.2012.11.106.