Correlation between Filled Via and Produced Cuprous Ion Concentration by Reverse Current Waveform

• Published in: Journal of the Electrochemical Society Vol. 160; no. 6; pp. D256 - D259
• Main Authors: Hayashi, Taro, Kondo, Kazuo, Saito, Takeyasu, Okamoto, Naoki, Yokoi, Masayuki, Takeuchi, Minoru, Bunya, Masaru, Marunaka, Masao, Tsuchiya, Takayuki
• Format: Journal Article
• Language: English
• Published: The Electrochemical Society 01.01.2013

To enable low power consumption and the access speed increase, three dimensional packaging of semiconductor chips has been proposed. In particular, a high-aspect ratio through silicon via (TSV) allows short chip to chip interconnection. In this study, we studied the role of produced cuprous ion in v...