Kinetic peculiarities of anodic dissolution of copper and its gold alloys accompanied by the formation of insoluble Cu(I) products
The kinetics of anodic dissolution of Cu and Cu–Au alloys (0.1–30 at.% Au) in aqueous chloride-containing universal buffer mixture (pH 1.25–11.90) in the potential range of insoluble Cu(I) products formation has been examined using the technique of multicyclic voltammetry and chronoamperometry of st...
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| Published in | Corrosion science Vol. 45; no. 10; pp. 2391 - 2413 |
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| Main Authors | , |
| Format | Journal Article |
| Language | English |
| Published |
Oxford
Elsevier Ltd
01.10.2003
Elsevier Science |
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| Abstract | The kinetics of anodic dissolution of Cu and Cu–Au alloys (0.1–30 at.% Au) in aqueous chloride-containing universal buffer mixture (pH 1.25–11.90) in the potential range of insoluble Cu(I) products formation has been examined using the technique of multicyclic voltammetry and chronoamperometry of stationary and rotating electrodes. After the formation of anodic film, mass transport controls the dissolution; the phase where the transport is localised depends on the nature of the film, pH of the solution and the alloy composition. The initial stage of CuCl formation on Cu and low-concentration Cu–Au alloys is controlled by 2D-nucleation. |
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| AbstractList | The kinetics of anodic dissolution of Cu and Cu–Au alloys (0.1–30 at.% Au) in aqueous chloride-containing universal buffer mixture (pH 1.25–11.90) in the potential range of insoluble Cu(I) products formation has been examined using the technique of multicyclic voltammetry and chronoamperometry of stationary and rotating electrodes. After the formation of anodic film, mass transport controls the dissolution; the phase where the transport is localised depends on the nature of the film, pH of the solution and the alloy composition. The initial stage of CuCl formation on Cu and low-concentration Cu–Au alloys is controlled by 2D-nucleation. |
| Author | Grushevskaya, S.N. Vvedenskii, A.V. |
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| Snippet | The kinetics of anodic dissolution of Cu and Cu–Au alloys (0.1–30 at.% Au) in aqueous chloride-containing universal buffer mixture (pH 1.25–11.90) in the... The kinetics of anodic dissolution of Cu and Cu-Au alloys (0.1-30 at.% Au) in aqueous chloride-containing universal buffer mixture (pH 1.25-11.90) in the... |
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| SubjectTerms | A. Alloy, copper B. Cyclic voltammetry C. Anodic films, selective oxidation |
| Title | Kinetic peculiarities of anodic dissolution of copper and its gold alloys accompanied by the formation of insoluble Cu(I) products |
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