Compact Thermal Model for the Transient Temperature Prediction of a Water-Cooled Microchip Module in Low Carbon Emission Computing

• Published in: Numerical heat transfer. Part A, Applications Vol. 59; no. 11; pp. 815 - 835
• Main Authors: Kubilay, A., Zimmermann, S., Zinovik, I., Michel, B., Poulikakos, D.
• Format: Journal Article
• Language: English
• Published: Philadelphia Taylor & Francis Group 01.06.2011; Taylor & Francis Ltd
• Subjects: Carbon; Chips; Computation; Computer simulation; Cooling; Electronics; Heat sinks; Heat transfer; Mathematical models; Microprocessors; Simulation; Temperature; Water temperature

This article presents a compact computational model for the rapid determination of the junction temperature of a chip cooled with a heat sink, exploring the concept of hot water cooled electronics as a strategy to reduce the carbon footprint of data centers. The model aims at rapid simulations of va...