Spin–orbit torques of an in-plane magnetized system modulated by the spin transport in the ferromagnetic Co layer

Spin–orbit torque (SOT) magnetoresistive random-access memory (MRAM) devices have been proposed for energy efficient memory and computing applications. New classes of materials such as antiferromagnets, topological insulators, and semimetals can generate spins with unconventional polarization and im...

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Bibliographic Details
Published inAPL materials Vol. 9; no. 10; pp. 101106 - 101106-8
Main Authors Xue, Fen, Lin, Shy-Jay, Li, Peng, Hwang, William, Huang, Yen-Lin, Tsai, Wilman, Wang, Shan X.
Format Journal Article
LanguageEnglish
Published AIP Publishing LLC 01.10.2021
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Summary:Spin–orbit torque (SOT) magnetoresistive random-access memory (MRAM) devices have been proposed for energy efficient memory and computing applications. New classes of materials such as antiferromagnets, topological insulators, and semimetals can generate spins with unconventional polarization and improve the efficiency of field-free SOT switching. In this work, we report significant changes in SOTs due to a Co thin film inserted in the Pt/Co/Mg/CoFeB heterostructures. Remarkably, the damping-like effective field has been enhanced by 7.4 times after inserting a thin Co layer with weak perpendicular magnetic anisotropy (PMA), while the field-like effective field is reduced to near zero value. Independent characterizations were performed to verify the presence of the changes in SOTs following spin modulation by the Co insertion layer. In addition, we found that the dynamic spin pumping coupling between Pt/Co with weak PMA and the in-plane CoFeB could significantly modulate the effective SOTs in the heterostructure, and this effect is dependent on the thickness of the spacer Mg through long-range spin-wave mediated coupling. Our work has experimentally demonstrated a new avenue to modulate SOTs with physically sputtered metal layers, and this finding is promising to enable flexible and efficient spin polarizations for MRAM devices.
ISSN:2166-532X
2166-532X
DOI:10.1063/5.0048917