A Double-Side Cooled SiC MOSFET Power Module With Sintered-Silver Interposers: I-Design, Simulation, Fabrication, and Performance Characterization - Ding, Chao; Liu, Heziqi; Ngo, Khai D. T.; Burgos, Rolando; Lu, Guo-Quan (IEEE transactions on power electronics, 2021)
Keywords: Bonding; Cooling; Double-side cooled power module; ENGINEERING; Formability; Heat treatment; Low temperature; Modules; MOSFETs; reduction of thermo-mechanical stress; reduction of thermomechanical stress; Silicon carbide; Silver; sintered-Ag die-attach; sintered-Ag interposer; Sintering (powder metallurgy); Stress; Substrates; Surface finishing; Thermomechanical processes