A novel power plane with super-wideband elimination of ground bounce noise on high speed circuits

• Published in: IEEE microwave and wireless components letters Vol. 15; no. 3; pp. 174 - 176
• Main Authors: Tzong-Lin Wu, Chien-Chung Wang, Yen-Hui Lin, Ting-Kuang Wang, Chang, G.
• Format: Journal Article
• Language: English
• Published: IEEE 01.03.2005
• Subjects: Bandwidth; Circuit noise; Degradation; Digital circuits; Electromagnetic bandgap (EBG); Electromagnetic interference; Frequency; ground bounce noise (GBN); high-speed digital circuits; Metamaterials; Mutual coupling; Periodic structures; Photonic band gap; power integrity; signal integrity; simultaneously switching noises

A novel L-bridged electromagnetic bandgap (EBG) power/ground planes is proposed with super-wideband suppression of the ground bounce noise (GBN) from 600Mz to 4.6GHz. The L-shaped bridge design on the EBG power plane not only broadens the stopband bandwidth, but also can increase the mutual coupling...