APA (7th ed.) Citation

Lima, T. S., de Gouveia, G. L., da Silva Septimio, R., da Cruz, C. B., Silva, B. L., Brito, C., . . . Cheung, N. (2019). Sn-0.5Cu(-x)Al Solder Alloys: Microstructure-Related Aspects and Tensile Properties Responses. Metals (Basel ), 9(2), 241. https://doi.org/10.3390/met9020241

Chicago Style (17th ed.) Citation

Lima, Thiago Soares, Guilherme Lisboa de Gouveia, Rudimylla da Silva Septimio, Clarissa Barros da Cruz, Bismarck Luiz Silva, Crystopher Brito, José Eduardo Spinelli, and Noé Cheung. "Sn-0.5Cu(-x)Al Solder Alloys: Microstructure-Related Aspects and Tensile Properties Responses." Metals (Basel ) 9, no. 2 (2019): 241. https://doi.org/10.3390/met9020241.

MLA (9th ed.) Citation

Lima, Thiago Soares, et al. "Sn-0.5Cu(-x)Al Solder Alloys: Microstructure-Related Aspects and Tensile Properties Responses." Metals (Basel ), vol. 9, no. 2, 2019, p. 241, https://doi.org/10.3390/met9020241.