Investigation of interface healing behavior in 1.5 wt.%CNTs/Al–4Cu–1Mg composite solid-state bonding joints influenced by surface processing marks
Joint units processed by milling and grinding, which varied in surface processing marks, were used in solid-state bonding experiments to study how these marks affect the healing behavior of CNTs/Al composite bonding interfaces. The results showed that these machining marks significantly impact inter...
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Published in | Journal of materials research and technology Vol. 31; pp. 3332 - 3348 |
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Main Authors | , , , , , , |
Format | Journal Article |
Language | English |
Published |
Elsevier B.V
01.07.2024
Elsevier |
Subjects | |
Online Access | Get full text |
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