Multipacting mitigation by atomic layer deposition: The case study of titanium nitride

• Published in: Journal of applied physics Vol. 136; no. 8
• Main Authors: Kalboussi, Y., Dadouch, S., Delatte, B., Miserque, F., Dragoe, D., Eozenou, F., Baudrier, M., Tusseau-Nenez, S., Zheng, Y., Maurice, L., Cenni, E., Bertrand, Q., Sahuquet, P., Fayette, E., Jullien, G., Inguimbert, C., Belhaj, M., Proslier, T.
• Format: Journal Article
• Language: English
• Published: Melville American Institute of Physics 28.08.2024
• Subjects: Atomic layer epitaxy; Complex shape objects; Electrical resistivity; Electron emission; Engineering Sciences; Film thickness; Particle accelerators; Physics; Titanium nitride; Particle accelerators; Electron yield; Atomic layer deposition; Crystallographic defects; Total electron emission yield TEEY; Superconductivity

This study investigates the use of atomic layer deposition (ALD) to mitigate multipacting phenomena inside superconducting radio frequency cavities used in particle accelerators while preserving high quality factors in the 1010 range. The unique ALD capability to control the film thickness down to t...