A lifetime assessment and prediction method for large area solder joints

Mechanical bending fatigue experiments were conducted on large area Pb-rich and SnSb-based model solder joints consisting of Cu-strip/solder/DCB substrates. Experimental lifetime curves in the range between 105 and 108 loading cycles at room and elevated temperature showed an improved fatigue resist...

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Bibliographic Details
Published inMicroelectronics and reliability Vol. 114; p. 113888
Main Authors Lederer, M., Kotas, A. Betzwar, Khatibi, G.
Format Journal Article
LanguageEnglish
Published Elsevier Ltd 01.11.2020
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