Effect of a Cu seed layer on electroplated Cu film

• Published in: Microelectronic engineering Vol. 105; pp. 18 - 24
• Main Authors: Pan, Yan, Liu, Yuhong, Wang, Tongqing, Lu, Xinchun
• Format: Journal Article
• Language: English
• Published: Amsterdam Elsevier B.V 01.05.2013; Elsevier
• Subjects: ADHESION; Applied sciences; CHEMICAL PROPERTIES; Condensed matter: structure, mechanical and thermal properties; Copper; CORROSION; Cross-disciplinary physics: materials science; rheology; CRYSTAL ORIENTATION; Crystallography; Cu film; Deposition by sputtering; Electroplate; ELECTROPLATING; Exact sciences and technology; Grain size; GRAIN SIZE AND SHAPE; HARDNESS; Materials science; Mechanical and acoustical properties of condensed matter; Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology; Mechanical properties of solids; Mechanical property; Metals. Metallurgy; Methods of deposition of films and coatings; film growth and epitaxy; Morphology; Orientation; Other heat and thermomechanical treatments; Physics; PROPERTIES; Seeds; Sputtering; Treatment of materials and its effects on microstructure and properties; Tribology and hardness; Electroplate; Cu film; Corrosion; Mechanical property; Sputtering; Performance evaluation; Grain size analysis; Barrier layer; Crystal orientation; Roughness; Texture; Surface structure; Microelectronic fabrication; Hardness testing; Chemical properties; Copper; Grain size; Crystallographic direction; Surface morphology; Mechanical properties; Grain orientation; Hardness; Adhesion; Layer thickness; Corrosion resistance; Sputter deposition; Microstructure

[Display omitted] ► The morphology of the electroplated Cu films is influenced by the Cu layers. ► The hardness of the electroplated Cu film is influenced by Cu seed layer. ► The Cu film adhesion is influenced by Cu seed layer. ► The Cu film is less corrosion-resistant when its roughness value is hi...