Effect of a Cu seed layer on electroplated Cu film - Pan, Yan; Liu, Yuhong; Wang, Tongqing; Lu, Xinchun (Microelectronic engineering, 2013)
Keywords: ADHESION; Applied sciences; CHEMICAL PROPERTIES; Condensed matter: structure, mechanical and thermal properties; Copper; CORROSION; Cross-disciplinary physics: materials science; rheology; CRYSTAL ORIENTATION; Crystallography; Cu film; Deposition by sputtering; Electroplate; ELECTROPLATING; Exact sciences and technology; Grain size; GRAIN SIZE AND SHAPE; HARDNESS; Materials science; Mechanical and acoustical properties of condensed matter; Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology; Mechanical properties of solids; Mechanical property; Metals. Metallurgy; Methods of deposition of films and coatings; film growth and epitaxy; Morphology; Orientation; Other heat and thermomechanical treatments; Physics; PROPERTIES; Seeds; Sputtering; Treatment of materials and its effects on microstructure and properties; Tribology and hardness; Electroplate; Cu film; Corrosion; Mechanical property; Sputtering; Performance evaluation; Grain size analysis; Barrier layer; Crystal orientation; Roughness; Texture; Surface structure; Microelectronic fabrication; Hardness testing; Chemical properties; Copper; Grain size; Crystallographic direction; Surface morphology; Mechanical properties; Grain orientation; Hardness; Adhesion; Layer thickness; Corrosion resistance; Sputter deposition; Microstructure