APA (7th ed.) Citation

Pan, Y., Liu, Y., Wang, T., & Lu, X. (2013). Effect of a Cu seed layer on electroplated Cu film. Microelectronic engineering, 105, 18-24. https://doi.org/10.1016/j.mee.2012.12.004

Chicago Style (17th ed.) Citation

Pan, Yan, Yuhong Liu, Tongqing Wang, and Xinchun Lu. "Effect of a Cu Seed Layer on Electroplated Cu Film." Microelectronic Engineering 105 (2013): 18-24. https://doi.org/10.1016/j.mee.2012.12.004.

MLA (9th ed.) Citation

Pan, Yan, et al. "Effect of a Cu Seed Layer on Electroplated Cu Film." Microelectronic Engineering, vol. 105, 2013, pp. 18-24, https://doi.org/10.1016/j.mee.2012.12.004.