Numerical and experimental investigation on multi-zone chemical mechanical planarization - Wang, Tongqing; Lu, Xinchun (Microelectronic engineering, 2011)
Keywords: Applied sciences; Chemical-mechanical polishing; CMP; Contact stress; Contact stresses; Electronics; Exact sciences and technology; Material removal rate; Mathematical analysis; Mathematical models; Microelectronic fabrication (materials and surfaces technology); Multi-zone; Polishing; Retaining ring; Retaining rings; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Stress concentration; Wafers; Within wafer non-uniformity; Material removal rate; Contact stress; Retaining ring; CMP; Multi-zone; Within wafer non-uniformity; Finite element method; Microelectronic fabrication; Stress distribution; Wear rate; Numerical simulation; Applied load; Chemical mechanical polishing; Wafer