Statistical Pattern Recognition and Built-in Reliability Test for Feature Extraction and Health Monitoring of Electronics Under Shock Loads - Lall, P.; Choudhary, P.; Gupte, S.; Hofmeister, J. (IEEE transactions on components and packaging technologies, 2009)
Keywords: Assembly; Boundary conditions; Built-in self-test; Condition monitoring; Confidence intervals; Damage; Electric shock; Electronic equipment; Electronic equipment testing; Failure; Failure analysis; Feature extraction; Finite element analysis; finite element methods; Frequency; health monitoring; Indicators; Lead; Mathematical models; Pattern recognition; Progressions; reliability modeling; reliability testing; shock; Strain; Studies; vibration