Thermal Neutron Absorption in Printed Circuit Boards

• Published in: IEEE transactions on nuclear science Vol. 68; no. 4; pp. 463 - 469
• Main Authors: Platt, Simon P., August, Shaun, MacLeod, Michael, Anderson, Michael J., Cheneler, David, Monk, Stephen D.
• Format: Journal Article
• Language: English
• Published: New York IEEE 01.04.2021; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Absorption; Attenuation; Attenuation coefficients; Boron; Circuit boards; Detectors; Glass fiber reinforced plastics; Glass substrates; Glass-epoxy composites; Neutron absorption; Neutron counters; Neutron scattering; Neutrons; Printed circuit boards; Printed circuits; reactor instrumentation; Resins; Substrates; Thermal neutrons; Thermal simulation

Measurements and simulations of thermal neutron attenuation by printed circuit boards (PCBs) are compared. Attenuation coefficients in typical epoxy-resin/glass-fiber substrate material can be as high as 2 cm −1 , corresponding to 27% attenuation by 1.6 mm of the substrate. Attenuation is attributed...