Ferroelectric Switching in Sub-20 nm Aluminum Scandium Nitride Thin Films

Ferroelectric switching was studied in 20 nm thick Al 0.68 Sc 0.32 N and Al 0.64 Sc 0.36 N films (with ~4 nm surface oxides) on platinized silicon wafers by multiple electrical characterization methods. Positive up negative down (PUND) measurements were conducted using 100 μs monopolar triangular wa...

Full description

Saved in:
Bibliographic Details
Published inIEEE electron device letters Vol. 41; no. 12; pp. 1774 - 1777
Main Authors Wang, Dixiong, Zheng, Jeffrey, Musavigharavi, Pariasadat, Zhu, Wanlin, Foucher, Alexandre C., Trolier-McKinstry, Susan E., Stach, Eric A., Olsson, Roy H.
Format Journal Article
LanguageEnglish
Published New York IEEE 01.12.2020
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects
Online AccessGet full text

Cover

Loading…
Abstract Ferroelectric switching was studied in 20 nm thick Al 0.68 Sc 0.32 N and Al 0.64 Sc 0.36 N films (with ~4 nm surface oxides) on platinized silicon wafers by multiple electrical characterization methods. Positive up negative down (PUND) measurements were conducted using 100 μs monopolar triangular waveform excitation. At room temperature, Al 0.68 Sc 0.32 N exhibited an apparent remanent polarization, P r = 140 μC/cm 2 and a coercive field, E c = 6.5 MV/cm, while film leakage prevented quantitative measurement of the Al 0.64 Sc 0.36 N ferroelectric properties. Remanent polarizations of 75 μC/cm 2 for Al 0.68 Sc 0.32 N and 25μC/cm 2 for Al 0.64 Sc 0.36 N were measured at 120 K. Partial ferroelectric switching was confirmed at room temperature for both materials via the measured transverse piezoelectric coefficients (e 31, f ) of -1.3 C/m 2 (down-switching) and -0.3 C/m 2 (up-switching) for Al 0.68 Sc 0.32 N, and -0.9 C/m 2 (down-switching) and -0.7 C/m 2 (up-switching) for Al 0.64 Sc 0.36 N.
AbstractList Ferroelectric switching was studied in 20 nm thick Al 0.68 Sc 0.32 N and Al 0.64 Sc 0.36 N films (with ~4 nm surface oxides) on platinized silicon wafers by multiple electrical characterization methods. Positive up negative down (PUND) measurements were conducted using 100 μs monopolar triangular waveform excitation. At room temperature, Al 0.68 Sc 0.32 N exhibited an apparent remanent polarization, P r = 140 μC/cm 2 and a coercive field, E c = 6.5 MV/cm, while film leakage prevented quantitative measurement of the Al 0.64 Sc 0.36 N ferroelectric properties. Remanent polarizations of 75 μC/cm 2 for Al 0.68 Sc 0.32 N and 25μC/cm 2 for Al 0.64 Sc 0.36 N were measured at 120 K. Partial ferroelectric switching was confirmed at room temperature for both materials via the measured transverse piezoelectric coefficients (e 31, f ) of -1.3 C/m 2 (down-switching) and -0.3 C/m 2 (up-switching) for Al 0.68 Sc 0.32 N, and -0.9 C/m 2 (down-switching) and -0.7 C/m 2 (up-switching) for Al 0.64 Sc 0.36 N.
Ferroelectric switching was studied in 20 nm thick Al0.68Sc0.32N and Al0.64Sc0.36N films (with ~4 nm surface oxides) on platinized silicon wafers by multiple electrical characterization methods. Positive up negative down (PUND) measurements were conducted using 100 [Formula Omitted] monopolar triangular waveform excitation. At room temperature, Al0.68Sc0.32N exhibited an apparent remanent polarization, [Formula Omitted]/cm2 and a coercive field, [Formula Omitted] MV/cm, while film leakage prevented quantitative measurement of the Al0.64Sc0.36N ferroelectric properties. Remanent polarizations of [Formula Omitted]/cm2 for Al0.68Sc0.32N and [Formula Omitted]/cm2for Al0.64Sc0.36N were measured at 120 K. Partial ferroelectric switching was confirmed at room temperature for both materials via the measured transverse piezoelectric coefficients (e31, f) of −1.3 C/m2 (down-switching) and −0.3 C/m2 (up-switching) for Al0.68Sc0.32N, and −0.9 C/m2 (down-switching) and −0.7 C/m2 (up-switching) for Al0.64Sc0.36N.
Author Zheng, Jeffrey
Musavigharavi, Pariasadat
Zhu, Wanlin
Olsson, Roy H.
Foucher, Alexandre C.
Wang, Dixiong
Trolier-McKinstry, Susan E.
Stach, Eric A.
Author_xml – sequence: 1
  givenname: Dixiong
  orcidid: 0000-0002-2067-3646
  surname: Wang
  fullname: Wang, Dixiong
  email: dixiongw@seas.upenn.edu
  organization: Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, PA, USA
– sequence: 2
  givenname: Jeffrey
  surname: Zheng
  fullname: Zheng, Jeffrey
  organization: Department of Materials Science and Engineering, University of Pennsylvania, Philadelphia, PA, USA
– sequence: 3
  givenname: Pariasadat
  surname: Musavigharavi
  fullname: Musavigharavi, Pariasadat
  organization: Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, PA, USA
– sequence: 4
  givenname: Wanlin
  surname: Zhu
  fullname: Zhu, Wanlin
  organization: Materials Research Institute, Pennsylvania State University, University Park, PA, USA
– sequence: 5
  givenname: Alexandre C.
  orcidid: 0000-0001-5042-4002
  surname: Foucher
  fullname: Foucher, Alexandre C.
  organization: Department of Materials Science and Engineering, University of Pennsylvania, Philadelphia, PA, USA
– sequence: 6
  givenname: Susan E.
  orcidid: 0000-0002-7267-9281
  surname: Trolier-McKinstry
  fullname: Trolier-McKinstry, Susan E.
  organization: Materials Research Institute, Pennsylvania State University, University Park, PA, USA
– sequence: 7
  givenname: Eric A.
  surname: Stach
  fullname: Stach, Eric A.
  organization: Department of Materials Science and Engineering, University of Pennsylvania, Philadelphia, PA, USA
– sequence: 8
  givenname: Roy H.
  surname: Olsson
  fullname: Olsson, Roy H.
  organization: Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, PA, USA
BookMark eNp9kD1PwzAQhi1UJNrCjsQSiTnl_Bl7rEoLlSoYCrPlOg64SpziJEL8e4xaMTAw3Ts8z53unaBRaIND6BrDDGNQd5vl_YwAgRkFynghztAYcy5z4IKO0BgKhnOKQVygSdftATBjBRuj9crF2Lra2T56m20_fW_ffXjLfMi2wy4nkIUmm9dD48PQZFtrQulTePKJL132kuBs5eumu0Tnlak7d3WaU_S6Wr4sHvPN88N6Md_klvKizx1TmEprMSUMG4OZLPkOnFKOEEVKUVguJBMqZeloAbKqSkN3pakgMUVFp-j2uPcQ24_Bdb3et0MM6aQmTHBGFZGQKDhSNrZdF12lD9E3Jn5pDPqnMJ0K0z-F6VNhSRF_FOt70_s29NH4-j_x5ih659zvHZX-k4zQb0J8eBc
CODEN EDLEDZ
CitedBy_id crossref_primary_10_1016_j_mtcomm_2022_103842
crossref_primary_10_35848_1347_4065_ad2a9e
crossref_primary_10_1038_s41565_023_01361_y
crossref_primary_10_3390_coatings13010054
crossref_primary_10_1002_aelm_202400279
crossref_primary_10_1007_s40820_024_01441_1
crossref_primary_10_1002_pssr_202100087
crossref_primary_10_1063_5_0156514
crossref_primary_10_1063_5_0060021
crossref_primary_10_2109_jcersj2_21184
crossref_primary_10_1063_5_0161746
crossref_primary_10_1063_5_0161423
crossref_primary_10_1063_5_0099913
crossref_primary_10_1063_5_0164430
crossref_primary_10_1021_acs_jpcc_1c01523
crossref_primary_10_1063_5_0136265
crossref_primary_10_1088_2053_1591_ac99c0
crossref_primary_10_1002_pssr_202200312
crossref_primary_10_1038_s44306_024_00011_w
crossref_primary_10_1039_D4MH00153B
crossref_primary_10_1002_advs_202302296
crossref_primary_10_1111_jace_19540
crossref_primary_10_35848_1347_4065_abe644
crossref_primary_10_1021_acs_nanolett_0c05051
crossref_primary_10_1038_s41565_023_01399_y
crossref_primary_10_1063_5_0054539
crossref_primary_10_1021_acsaelm_2c01421
crossref_primary_10_1002_aelm_202400849
crossref_primary_10_1002_pssr_202000575
crossref_primary_10_35848_1347_4065_ac5d13
crossref_primary_10_1063_5_0147224
crossref_primary_10_1016_j_apsusc_2023_157921
crossref_primary_10_1063_5_0051940
crossref_primary_10_1063_5_0037617
crossref_primary_10_1109_TED_2021_3139054
crossref_primary_10_1002_aelm_202200005
crossref_primary_10_35848_1347_4065_ad21bd
crossref_primary_10_1021_acs_nanolett_4c06178
crossref_primary_10_3390_nano14110986
crossref_primary_10_1116_6_0004180
crossref_primary_10_1063_5_0106717
crossref_primary_10_1109_LED_2024_3453111
crossref_primary_10_1063_5_0103578
crossref_primary_10_1007_s11664_024_11673_x
crossref_primary_10_1063_5_0064041
crossref_primary_10_3390_mi13101629
crossref_primary_10_1007_s11433_024_2466_0
crossref_primary_10_1002_adom_202401555
crossref_primary_10_1002_aelm_202300489
crossref_primary_10_1080_10408436_2022_2083579
crossref_primary_10_1002_adma_202108841
crossref_primary_10_1109_LED_2023_3282170
crossref_primary_10_1038_s41928_024_01148_6
crossref_primary_10_1063_5_0200057
crossref_primary_10_1039_D2MA00044J
crossref_primary_10_1063_5_0223553
crossref_primary_10_1021_acsaelm_2c01409
crossref_primary_10_1002_pssr_202100201
crossref_primary_10_1021_acsami_2c18313
crossref_primary_10_1109_TED_2024_3506513
crossref_primary_10_3390_electronics13224515
crossref_primary_10_1021_acsami_4c03442
crossref_primary_10_3390_inorganics13020029
crossref_primary_10_1088_1361_6641_acb80e
crossref_primary_10_1002_adfm_202303956
crossref_primary_10_1016_j_mtcomm_2024_110834
crossref_primary_10_1063_5_0057869
crossref_primary_10_1063_5_0075636
crossref_primary_10_35848_1882_0786_ac2261
Cites_doi 10.1002/adfm.201700461
10.1116/1.5065517
10.1016/S0924-4247(98)00161-7
10.1063/1.3636417
10.1109/ESSDERC.2013.6818868
10.1063/1.5140612
10.1557/mrs2004.235
10.1063/1.2336999
10.1186/1556-276X-9-526
10.1063/1.5084945
10.1063/1.4829064
10.1109/LED.2002.1015207
10.1109/IMW.2013.6582115
10.1109/JETCAS.2016.2547704
10.1109/ICSICT.2004.1435092
10.1109/LED.2012.2204856
10.2109/jcersj2.118.1166
10.1063/1.3634052
ContentType Journal Article
Copyright Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2020
Copyright_xml – notice: Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2020
DBID 97E
RIA
RIE
AAYXX
CITATION
7SP
8FD
L7M
DOI 10.1109/LED.2020.3034576
DatabaseName IEEE Xplore (IEEE)
IEEE All-Society Periodicals Package (ASPP) 1998–Present
IEEE Electronic Library (IEL)
CrossRef
Electronics & Communications Abstracts
Technology Research Database
Advanced Technologies Database with Aerospace
DatabaseTitle CrossRef
Technology Research Database
Advanced Technologies Database with Aerospace
Electronics & Communications Abstracts
DatabaseTitleList
Technology Research Database
Database_xml – sequence: 1
  dbid: RIE
  name: IEEE Electronic Library (IEL)
  url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/
  sourceTypes: Publisher
DeliveryMethod fulltext_linktorsrc
Discipline Engineering
EISSN 1558-0563
EndPage 1777
ExternalDocumentID 10_1109_LED_2020_3034576
9241842
Genre orig-research
GrantInformation_xml – fundername: NSF National Nanotechnology Coordinated Infrastructure Program
  grantid: NNCI-1542153
– fundername: Semiconductor Research Corporation (SRC)
  funderid: 10.13039/100000028
– fundername: NSF through the University of Pennsylvania Materials Research Science and Engineering Center (MRSEC)
  grantid: DMR-1720530
  funderid: 10.13039/100006920
– fundername: Singh Center for Nanotechnology
– fundername: Defense Advanced Research Projects Agency (DARPA), Tunable Ferroelectric Nitrides (TUFEN) Program
  grantid: HR00112090046; HR00112090047
  funderid: 10.13039/100000185
GroupedDBID -~X
.DC
0R~
29I
4.4
5GY
5VS
6IK
97E
AAJGR
AARMG
AASAJ
AAWTH
ABAZT
ABQJQ
ABVLG
ACGFO
ACIWK
ACNCT
AENEX
AETIX
AFFNX
AGQYO
AGSQL
AHBIQ
AI.
AIBXA
AKJIK
AKQYR
ALLEH
ALMA_UNASSIGNED_HOLDINGS
ATWAV
BEFXN
BFFAM
BGNUA
BKEBE
BPEOZ
CS3
DU5
EBS
EJD
HZ~
IBMZZ
ICLAB
IFIPE
IFJZH
IPLJI
JAVBF
LAI
M43
O9-
OCL
P2P
RIA
RIE
RNS
TAE
TN5
TWZ
VH1
AAYXX
CITATION
RIG
7SP
8FD
L7M
ID FETCH-LOGICAL-c357t-e49138cc13241aa148d5b0e99e2292d67c56846992d8e3708ffda3bdaf099e7f3
IEDL.DBID RIE
ISSN 0741-3106
IngestDate Mon Jun 30 10:16:03 EDT 2025
Thu Apr 24 22:52:47 EDT 2025
Tue Jul 01 02:39:27 EDT 2025
Wed Aug 27 06:02:31 EDT 2025
IsPeerReviewed true
IsScholarly true
Issue 12
Language English
License https://ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html
https://doi.org/10.15223/policy-029
https://doi.org/10.15223/policy-037
LinkModel DirectLink
MergedId FETCHMERGED-LOGICAL-c357t-e49138cc13241aa148d5b0e99e2292d67c56846992d8e3708ffda3bdaf099e7f3
Notes ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 14
ORCID 0000-0001-5042-4002
0000-0002-2067-3646
0000-0002-7267-9281
PQID 2465439280
PQPubID 85488
PageCount 4
ParticipantIDs proquest_journals_2465439280
crossref_citationtrail_10_1109_LED_2020_3034576
crossref_primary_10_1109_LED_2020_3034576
ieee_primary_9241842
ProviderPackageCode CITATION
AAYXX
PublicationCentury 2000
PublicationDate 2020-12-01
PublicationDateYYYYMMDD 2020-12-01
PublicationDate_xml – month: 12
  year: 2020
  text: 2020-12-01
  day: 01
PublicationDecade 2020
PublicationPlace New York
PublicationPlace_xml – name: New York
PublicationTitle IEEE electron device letters
PublicationTitleAbbrev LED
PublicationYear 2020
Publisher IEEE
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher_xml – name: IEEE
– name: The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
References ref13
ref12
ref15
ref14
ref11
ref10
müller (ref9) 2011; 99
ref2
ref1
ref17
ref16
ref19
ref18
ref8
ref7
ref4
ref3
ref6
yoo (ref5) 2005
References_xml – ident: ref12
  doi: 10.1002/adfm.201700461
– start-page: 100
  year: 2005
  ident: ref5
  article-title: Highly reliable 50nm-thick PZT capacitor and low voltage FRAM device using Ir/SrRuO?/MOCVD PZT capacitor technology
  publication-title: Dig Tech Papers Symp VLSI Technol
– ident: ref17
  doi: 10.1116/1.5065517
– ident: ref18
  doi: 10.1016/S0924-4247(98)00161-7
– volume: 99
  year: 2011
  ident: ref9
  article-title: Ferroelectric Zr?.?Hf?.?O?thin films for nonvolatile memory applications
  publication-title: Appl Phys Lett
  doi: 10.1063/1.3636417
– ident: ref11
  doi: 10.1109/ESSDERC.2013.6818868
– ident: ref13
  doi: 10.1063/1.5140612
– ident: ref4
  doi: 10.1557/mrs2004.235
– ident: ref7
  doi: 10.1063/1.2336999
– ident: ref1
  doi: 10.1186/1556-276X-9-526
– ident: ref15
  doi: 10.1063/1.5084945
– ident: ref14
  doi: 10.1063/1.4829064
– ident: ref19
  doi: 10.1109/LED.2002.1015207
– ident: ref3
  doi: 10.1109/IMW.2013.6582115
– ident: ref2
  doi: 10.1109/JETCAS.2016.2547704
– ident: ref6
  doi: 10.1109/ICSICT.2004.1435092
– ident: ref10
  doi: 10.1109/LED.2012.2204856
– ident: ref16
  doi: 10.2109/jcersj2.118.1166
– ident: ref8
  doi: 10.1063/1.3634052
SSID ssj0014474
Score 2.5790098
Snippet Ferroelectric switching was studied in 20 nm thick Al 0.68 Sc 0.32 N and Al 0.64 Sc 0.36 N films (with ~4 nm surface oxides) on platinized silicon wafers by...
Ferroelectric switching was studied in 20 nm thick Al0.68Sc0.32N and Al0.64Sc0.36N films (with ~4 nm surface oxides) on platinized silicon wafers by multiple...
SourceID proquest
crossref
ieee
SourceType Aggregation Database
Enrichment Source
Index Database
Publisher
StartPage 1774
SubjectTerms Aluminum
Aluminum alloys
Aluminum scandium nitride
Coercivity
Electrical properties
Ferroelectric films
Ferroelectric materials
ferroelectric memory
ferroelectric thin film
Ferroelectricity
Nonvolatile memory
Piezoelectricity
Room temperature
Scandium
Silicon wafers
Switching
Thin films
Waveforms
Title Ferroelectric Switching in Sub-20 nm Aluminum Scandium Nitride Thin Films
URI https://ieeexplore.ieee.org/document/9241842
https://www.proquest.com/docview/2465439280
Volume 41
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV3PS8MwFA5zJz34a4rTKTl4EezWNUnbHIduTNFd5mC30vyCoutkaxH8631puzJUxNs7JCXkJV_e17x8D6Frw4NYamMcnyviUE6oI_rCc4zQQjJFBRg222Lij2f0cc7mDXRbv4XRWhfJZ7przeIuXy1lbn-V9YArACEBwN0B4la-1apvDCgtFZfhhARccesrSZf3nob3QAQ94Kcuocyqi2wdQUVNlR9AXJwuowP0vBlXmVTy2s0z0ZWf3yQb_zvwQ7RfhZl4UK6LI9TQ6THa2xIfbKGHkV6tlmUZnETi6UeSFXmVOEkxwAksbJwu8ADAK0nzBZ5K-wAGjEkC7ZXGtuInHiVvi_UJmo2GL3djpyqs4EjCgszRlPdJKCUwUdqPY2BEiglXc649j3vKDyTzIS7hYIeaBG5ojIqJULGBeFIHhpyiZrpM9RnCzBgeShYADkhwrAwZIKgfCmCBtsCsaaPeZq4jWamO2-IXb1HBPlwegXci652o8k4b3dQ93kvFjT_atuxk1-2qeW6jzsadUbUl15FnleMgGgzd8997XaBd--0yV6WDmtkq15cQcWTiqlhqX5tm0Ms
linkProvider IEEE
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV07T8MwED6hMgADb0R5emBBIm0edhKPCFoVKF1apG5R7NhSRJuikgqJX885SaMKEGK7wVEsn_PdffH5O4ArzYNYKq0tnyeeRblHLeEI19JCCckSKtAw1RYDv_dCH8dsvAY39V0YpVRRfKZaxizO8pOZXJhfZW3kCkhIEHDXMe4zp7ytVZ8ZUFpqLmOMRGSx60NJm7f7nXukgi4yVNujzOiLrAShoqvKDygu4kt3B56XMyvLSl5bi1y05Oc30cb_Tn0XtqtEk9yWO2MP1lS2D1sr8oMH8NBV8_msbISTSjL8SPOispKkGUFAwa1Nsim5RfhKs8WUDKW5AoPGIMXxiSKm5yfpppPp-yG8dDuju55VtVawpMeC3FKUO14oJXJR6sQxcqKECVtxrlyXu4kfSOZjZsLRDpUX2KHWSeyJJNaYUapAe0fQyGaZOgbCtOahZAEigUTXypAhhvqhQB5oWszqJrSXax3JSnfctL-YRAX_sHmE3omMd6LKO024rp94KzU3_hh7YBa7HletcxPOlu6Mqo_yPXKNdhzmg6F98vtTl7DRGz33o_7D4OkUNs17ysqVM2jk84U6x_wjFxfFtvsCr5TUFA
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Ferroelectric+Switching+in+Sub-20+nm+Aluminum+Scandium+Nitride+Thin+Films&rft.jtitle=IEEE+electron+device+letters&rft.au=Wang%2C+Dixiong&rft.au=Zheng%2C+Jeffrey&rft.au=Musavigharavi%2C+Pariasadat&rft.au=Zhu%2C+Wanlin&rft.date=2020-12-01&rft.pub=IEEE&rft.issn=0741-3106&rft.volume=41&rft.issue=12&rft.spage=1774&rft.epage=1777&rft_id=info:doi/10.1109%2FLED.2020.3034576&rft.externalDocID=9241842
thumbnail_l http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=0741-3106&client=summon
thumbnail_m http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=0741-3106&client=summon
thumbnail_s http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=0741-3106&client=summon