Response Surface Based Optimization Approach for Thermal Placement Design of Chips in Multiple-Chip Modules - Chen, Wen-Hwa; Cheng, Hsien-Chie; Chung, I-Chun (IEEE transactions on components and packaging technologies, 2009)
Keywords: Chips (electronics); Context modeling; Design engineering; Design optimization; Electronics packaging; Finite element methods; Finite element modeling; Mathematical model; Mathematical models; Methodology; multichip modules; nonlinear superposition technique; optimal chip placement design; Optimization; Optimization methods; Placement; Plastics; Position (location); Power system modeling; response surface (RS) methodology; Response surface methodology; Response surfaces; Studies; Temperature; thermal management