Performance Improvement of a Power Conversion Module by Liquid Micro-Jet Impingement Cooling

• Published in: IEEE transactions on components and packaging technologies Vol. 30; no. 2; pp. 309 - 316
• Main Authors: Bhunia, A., Chandrasekaran, S., Chung-Lung Chen
• Format: Journal Article
• Language: English
• Published: New York IEEE 01.06.2007; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Arrays; Closed loop; Conversion; Cooling; Devices; Dielectric liquids; Diodes; Frequency conversion; Impingement; impingement cooling; insulated gate bipolar transistor (IGBT) module; Insulated gate bipolar transistors; inverter; liquid micro-jet; Liquids; Modules; motor drive; Packaging; Power conversion; Power generation; Studies; Temperature; Thermal management; Voltage
• ISSN: 1521-3331; 1557-9972
• DOI: 10.1109/TCAPT.2007.898366

Liquid micro-jet array impingement cooling of a power conversion module with 12 power switching devices (six insulated gate bipolar transistors and six diodes) is investigated. The 1200-V/150-A module converts dc input power to variable frequency, variable voltage three-phase ac output to drive a 50HP three-phase induction motor. The silicon devices are attached to a packaging layer [direct bonded copper (DBC)], which in turn is soldered to a metal base plate. DI water micro-jet array impinges on the base plate of the module targeted at the footprint area of the devices. Although the high heat flux cooling capability of liquid impingement is a well-established finding, the impact of its practical implementation in power systems has never been addressed. This paper presents the first one-to-one comparison of liquid micro-jet array impingement cooling (JAIC) with the traditional methods, such as air-cooling over finned heat sink or liquid flow in multi-pass cold plate. Results show that compared to the conventional cooling methods, JAIC can significantly enhance the module output power. If the output power is maintained constant, the device temperature can be reduced drastically by JAIC. Furthermore, jet impingement provides uniform cooling for multiple devices placed over a large area, thereby reducing non-uniformity of temperature among the devices. The reduction in device temperature, both its absolute value and the non-uniformity, implies multi-fold increase in module reliability. The results thus illustrate the importance of efficient thermal management technique for compact and reliable power conversion application