Copper Underpotential Deposition on Gold in the Presence of Polyethylene Glycol and Chloride

• Published in: International journal of electrochemical science Vol. 6; no. 8; pp. 3416 - 3426
• Main Authors: Chiu, Yong-Da, Dow, Wei-Ping, Liu, Yung-Fang, Lee, Yuh-Lang, Yau, Shueh-Lin, Huang, Su-Mei
• Format: Journal Article
• Language: English
• Published: Elsevier B.V 01.08.2011
• Subjects: copper electrodeposition; overpotential deposition; Polyethylene glycol; suppressor; underpotential deposition; underpotential deposition; overpotential deposition; Polyethylene glycol; suppressor; copper electrodeposition

Many articles have shown that polyethylene glycol (PEG), when combined with chloride ions, is a strong suppressor of copper overpotential deposition (OPD) on a copper substrate. However, few articles have explored the roles of PEG and chloride ions in copper underpotential deposition (UPD) when the...