Mechanical FEM Simulation of bonding process on Cu lowK wafers - Degryse, D.; Vandevelde, B.; Beyne, E. (IEEE transactions on components and packaging technologies, 2004)
Keywords: Bonding; Bonding forces; Bonding processes; Circuit simulation; Computer simulation; Copper; Dielectric materials; Electric wire; Finite element method; Gold; Integrated circuit (IC) processing; Integrated circuit interconnections; Interconnection; lowK materials; Mathematical models; Silicon; Stress; Stresses; Studies; Wire