Lablali, M., Mes-adi, H., Eddiai, A., & Mazroui, M. (2023). Effect of stepped Si (001) substrate on Cu thin film growth. Surface topography metrology and properties, 11(3), 35020-35031. https://doi.org/10.1088/2051-672X/acfb9b
Chicago Style (17th ed.) CitationLablali, M., H. Mes-adi, A. Eddiai, and M. Mazroui. "Effect of Stepped Si (001) Substrate on Cu Thin Film Growth." Surface Topography Metrology and Properties 11, no. 3 (2023): 35020-35031. https://doi.org/10.1088/2051-672X/acfb9b.
MLA (9th ed.) CitationLablali, M., et al. "Effect of Stepped Si (001) Substrate on Cu Thin Film Growth." Surface Topography Metrology and Properties, vol. 11, no. 3, 2023, pp. 35020-35031, https://doi.org/10.1088/2051-672X/acfb9b.
Warning: These citations may not always be 100% accurate.