A comparative study of a new microscale technique and conventional bending techniques for evaluating the interface adhesion strength in IC metallization systems

• Published in: Journal of materials research Vol. 25; no. 10; pp. 1917 - 1928
• Main Authors: Kamiya, Shoji, Shimomura, Hiroshi, Omiya, Masaki, Suzuki, Takashi
• Format: Journal Article
• Language: English
• Published: New York, USA Cambridge University Press 01.10.2010; Springer International Publishing
• Subjects: Adhesion; Applied and Technical Physics; Biomaterials; Inorganic Chemistry; Materials Engineering; Materials Science; Microelectronics; Nanotechnology; Adhesion; Cu; Microelectronics

We developed a new microscale technique for evaluating the local interface adhesion in a thin film stack and we compared it with a conventional four-point bending technique. Using the microscale technique, the interface adhesion was estimated to be 3.0 J/m2 by comparing experimental results with num...