A comparative study of a new microscale technique and conventional bending techniques for evaluating the interface adhesion strength in IC metallization systems
We developed a new microscale technique for evaluating the local interface adhesion in a thin film stack and we compared it with a conventional four-point bending technique. Using the microscale technique, the interface adhesion was estimated to be 3.0 J/m2 by comparing experimental results with num...
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Published in | Journal of materials research Vol. 25; no. 10; pp. 1917 - 1928 |
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Main Authors | , , , |
Format | Journal Article |
Language | English |
Published |
New York, USA
Cambridge University Press
01.10.2010
Springer International Publishing |
Subjects | |
Online Access | Get full text |
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