Kinematic Optimization for Chemical Mechanical Polishing Based On Statistical Analysis of Particle Trajectories - Zhao, Dewen; Wang, Tongqing; He, Yongyong; Lu, Xinchun (IEEE transactions on semiconductor manufacturing, 2013)
Keywords: Applied sciences; Chemical mechanical polishing (CMP); Chemical-mechanical polishing; Chemicals; Couplings; Density; Electronics; Exact sciences and technology; Kinematics; Mathematical model; Mathematical models; Mechanical polishing; Microelectronic fabrication (materials and surfaces technology); nonuniformity; particle trajectory; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Semiconductors; Slurries; Trajectories; Trajectory; trajectory density; Variability; Statistical method; Microelectronic fabrication; Numerical simulation; Chemical mechanical polishing (CMP); kinematics; nonuniformity; Chemical mechanical polishing; Non uniform distribution; Optimization; Wafer; particle trajectory; trajectory density