Experimental and Numerical Analysis of Thermal and Thermomechanical Behavior of a Power Inductor Accompanied by a Reliability Study

• Published in: IOP conference series. Materials Science and Engineering Vol. 205; no. 1; pp. 12014 - 12019
• Main Authors: Bendaou, Om, Gautrelet, C, Elhami, A, Agouzoul, M
• Format: Journal Article
• Language: English
• Published: Bristol IOP Publishing 01.06.2017
• Subjects: Component reliability; Deformation effects; Electronic components; Finite element method; Mathematical models; Monte Carlo simulation; Numerical analysis; Reliability analysis; Speckle interferometry; Thermal measurement; Thermodynamic properties; Thermomechanical properties

In practice, when feeding the electrical and electronic components, they generate heat by Joule's effect, which will cause an increase in temperature and provoking mechanical deformations related to the expansion of the materials. It is therefore this aspect that is the subject of our study on...