Finite element analysis of expansion-matched submounts for high-power laser diodes packaging

• Published in: Journal of semiconductors Vol. 37; no. 6; pp. 72 - 76
• Main Author: 倪羽茜 马骁宇 井红旗 刘素平
• Format: Journal Article
• Language: English
• Published: Chinese Institute of Electronics 01.06.2016
• Subjects: coefficient of thermal expansion; finite element analysis; high-power laser diodes; thermal management; 中间层材料; 优化设计; 大功率激光二极管; 夹层结构; 封装; 底座; 有限元分析; 相匹配
• ISSN: 1674-4926
• DOI: 10.1088/1674-4926/37/6/064005

In order to improve the output power and increase the lifetime of laser diodes,expansion-matched submounts were investigated by finite element analysis.The submount was designed as sandwiched structure.By varying the vertical structure and material of the middle layer,the thermal expansion behavior on the mounting surface was simulated to obtain the expansion-matched design.In addition,the thermal performance of laser diodes packaged by different submounts was compared.The numerical results showed that,changing the thickness ratio of surface copper to middle layer will lead the stress and junction temperature to the opposite direction.Thus compromise needs to be made in the design of the vertical structure.In addition,the silicon carbide（SiC） is the most promising material candidate for the middle layer among the materials discussed in this paper.The simulated results were aimed at providing guidance for the optimal design of sandwich-structure submounts.