Influence of corrosion properties on electrochemical migration susceptibility of SnPb solders for PCBs
Electrochemical migration is caused by the adsorption of water and the bias voltages between the electrodes or pads which form an electric circuit or in the solders used to connect the parts. This work focused on the elucidation of the mechanisms of electrochemical migration of pure Sn, Sn37Pb, and...
Saved in:
| Published in | Metals and materials international Vol. 13; no. 2; pp. 129 - 137 |
|---|---|
| Main Authors | , |
| Format | Journal Article |
| Language | English |
| Published |
Seoul
Springer Nature B.V
01.04.2007
대한금속·재료학회 |
| Subjects | |
| Online Access | Get full text |
| ISSN | 1598-9623 2005-4149 1234-4320 |
| DOI | 10.1007/BF03027563 |
Cover
| Abstract | Electrochemical migration is caused by the adsorption of water and the bias voltages between the electrodes or pads which form an electric circuit or in the solders used to connect the parts. This work focused on the elucidation of the mechanisms of electrochemical migration of pure Sn, Sn37Pb, and Sn55Pb solders in electronics. The electrochemical migration behavior was discussed on the basis of the polarization behavior of SnPb solders. After the water drop test, the time to failure decreased with increasing Pb content in Cl^sup -^ solution and increased with increasing Pb content in SO^sub 4^ ^sup 2-^ solution. In the case of the SnPb solder alloys, the pitting potential, the passive current density, the cathodic current density and the efficiency of cathodic deposition of the alloying elements were closely related to the resistance of the electrochemical migration.[PUBLICATION ABSTRACT] |
|---|---|
| AbstractList | KCI Citation Count: 13 Electrochemical migration is caused by the adsorption of water and the bias voltages between the electrodes or pads which form an electric circuit or in the solders used to connect the parts. This work focused on the elucidation of the mechanisms of electrochemical migration of pure Sn, Sn37Pb, and Sn55Pb solders in electronics. The electrochemical migration behavior was discussed on the basis of the polarization behavior of SnPb solders. After the water drop test, the time to failure decreased with increasing Pb content in Cl super(-) solution and increased with increasing Pb content in SO sub(4) super(2-) solution. In the case of the SnPb solder alloys, the pitting potential, the passive current density, the cathodic current density and the efficiency of cathodic deposition of the alloying elements were closely related to the resistance of the electrochemical migration. Electrochemical migration is caused by the adsorption of water and the bias voltages between the electrodes or pads which form an electric circuit or in the solders used to connect the parts. This work focused on the elucidation of the mechanisms of electrochemical migration of pure Sn, Sn37Pb, and Sn55Pb solders in electronics. The electrochemical migration behavior was discussed on the basis of the polarization behavior of SnPb solders. After the water drop test, the time to failure decreased with increasing Pb content in Cl^sup -^ solution and increased with increasing Pb content in SO^sub 4^ ^sup 2-^ solution. In the case of the SnPb solder alloys, the pitting potential, the passive current density, the cathodic current density and the efficiency of cathodic deposition of the alloying elements were closely related to the resistance of the electrochemical migration.[PUBLICATION ABSTRACT] Electrochemical migration is caused by the adsorption of water and the bias voltages between the electrodes or pads which form an electric circuit or in the solders used to connect the parts. This work focused on the elucidation of the mechanisms of electrochemical migration of pure Sn, Sn37Pb, and Sn55Pb solders in electronics. The electrochemical migration behavior was discussed on the basis of the polarization behavior of SnPb solders. After the water drop test, the time to failure decreased with increasing Pb content in Clsolution and increased with increasing Pb content in SO42- solution. In the case of the SnPb solder alloys, the pitting potential, the passive current density, the cathodic current density and the efficiency of cathodic deposition of the alloying elements were closely related to the resistance of the electrochemical migration. |
| Author | Yoo, Y. R. Kim, Y. S. |
| Author_xml | – sequence: 1 givenname: Y. R. surname: Yoo fullname: Yoo, Y. R. – sequence: 2 givenname: Y. S. surname: Kim fullname: Kim, Y. S. |
| BackLink | https://www.kci.go.kr/kciportal/ci/sereArticleSearch/ciSereArtiView.kci?sereArticleSearchBean.artiId=ART001071586$$DAccess content in National Research Foundation of Korea (NRF) |
| BookMark | eNp9kV9LHDEUxYNYcN32xU8w9KEVYdqbfzOTR12qLgiV1j6HTDbRaDbZJpkHv30zbkGQ0vtyufA7F845x-gwxGAQOsHwBQP0Xy8ugQLpeUcP0IIA8JZhJg7RAnMxtKIj9Agd5_wI0GGKyQLZdbB-MkGbJtpGx5RidjE0uxR3JhVnclMv440uKeoHs3Va-Wbr7pMqM5enrM2uuNF5V57nHz_D7djk6Dcm5cbG1NyuLvJ79M4qn82Hv3uJfl1-u1tdtzffr9ar85tWU85KS3nPtbWk64nWdjOqgXe2JwPmut5aYGaBd5thHJnStmfYVLtQRR0zRBBCl-h0_zckK5-0k1G5l30f5VOS5z_u1rKHDgZe0c97tFr9PZlc5NZVL96rYOKUpcBCMEbrLNGn_5JECAGczeDHN-BjnFKohuUwUDrAXMwSwR7SNeqcjJXalZcwS1LOSwxyrlK-VlklZ28ku-S2Kj3_C_4Dfv6frQ |
| CitedBy_id | crossref_primary_10_1007_s10854_023_11369_8 crossref_primary_10_1002_maco_202112336 crossref_primary_10_1007_s12540_011_0814_8 crossref_primary_10_1016_j_corsci_2011_01_009 crossref_primary_10_1007_s10854_011_0435_5 crossref_primary_10_1149_1945_7111_acb61a crossref_primary_10_1007_s10854_020_03433_4 crossref_primary_10_1007_s12540_010_1015_6 crossref_primary_10_1016_j_engfailanal_2022_106329 crossref_primary_10_1007_s12540_010_1007_6 crossref_primary_10_1109_TDMR_2009_2022631 crossref_primary_10_1007_s10854_020_03880_z crossref_primary_10_1038_s41598_021_95276_0 crossref_primary_10_1007_s10854_013_1095_4 crossref_primary_10_1007_s12540_010_0814_0 crossref_primary_10_1016_j_corsci_2014_11_004 crossref_primary_10_1016_j_microrel_2011_06_023 crossref_primary_10_1007_s10854_010_0198_4 crossref_primary_10_1039_C7RA04368F |
| Cites_doi | 10.1002/j.1538-7305.1955.tb03793.x 10.1109/6040.846647 10.1109/33.2957 10.1007/s11664-999-0151-6 10.1016/j.tsf.2005.09.022 10.1109/95.465159 10.1109/33.56172 |
| ContentType | Journal Article |
| Copyright | Springer 2007 |
| Copyright_xml | – notice: Springer 2007 |
| DBID | AAYXX CITATION 7SR 8BQ 8FD 8FE 8FG ABJCF AFKRA BENPR BGLVJ CCPQU D1I DWQXO HCIFZ JG9 KB. PDBOC PHGZM PHGZT PKEHL PQEST PQGLB PQQKQ PQUKI PRINS 7SE ACYCR |
| DOI | 10.1007/BF03027563 |
| DatabaseName | CrossRef Engineered Materials Abstracts METADEX Technology Research Database ProQuest SciTech Collection ProQuest Technology Collection Materials Science & Engineering Collection ProQuest Central UK/Ireland ProQuest Central Technology Collection ProQuest One ProQuest Materials Science Collection ProQuest Central SciTech Premium Collection Materials Research Database Materials Science Database Materials Science Collection Proquest Central Premium ProQuest One Academic (New) ProQuest One Academic Middle East (New) ProQuest One Academic Eastern Edition (DO NOT USE) ProQuest One Applied & Life Sciences ProQuest One Academic ProQuest One Academic UKI Edition ProQuest Central China Corrosion Abstracts Korean Citation Index |
| DatabaseTitle | CrossRef ProQuest Materials Science Collection Materials Research Database Technology Collection Technology Research Database ProQuest One Academic Middle East (New) ProQuest One Academic Eastern Edition Materials Science Collection SciTech Premium Collection ProQuest One Community College ProQuest Technology Collection ProQuest SciTech Collection ProQuest Central China METADEX ProQuest Central ProQuest One Applied & Life Sciences Engineered Materials Abstracts ProQuest One Academic UKI Edition ProQuest Central Korea Materials Science & Engineering Collection Materials Science Database ProQuest One Academic ProQuest Central (New) ProQuest One Academic (New) Corrosion Abstracts |
| DatabaseTitleList | Materials Research Database ProQuest Materials Science Collection Materials Research Database |
| Database_xml | – sequence: 1 dbid: 8FG name: ProQuest Technology Collection url: https://search.proquest.com/technologycollection1 sourceTypes: Aggregation Database |
| DeliveryMethod | fulltext_linktorsrc |
| Discipline | Engineering |
| EISSN | 2005-4149 1234-4320 |
| EndPage | 137 |
| ExternalDocumentID | oai_kci_go_kr_ARTI_706085 2425044841 10_1007_BF03027563 |
| Genre | Feature |
| GroupedDBID | 06D 0R~ 0VY 123 1N0 2.D 203 29M 2JY 2KG 2VQ 30V 4.4 406 408 40D 5VS 67Z 8FE 8FG 96X 9ZL AAAVM AACDK AAHNG AAIAL AAIKT AAJBT AAJKR AANZL AAPKM AARHV AARTL AASML AATNV AATVU AAUYE AAWCG AAYIU AAYQN AAYTO AAYXX AAYZH AAZMS ABAKF ABBRH ABDBE ABDZT ABECU ABFSG ABFTD ABFTV ABJCF ABJNI ABJOX ABKCH ABMQK ABQBU ABQSL ABSXP ABTEG ABTHY ABTKH ABTMW ABXPI ACAOD ACDTI ACGFS ACHSB ACIWK ACKNC ACMDZ ACMLO ACOKC ACPIV ACSTC ACZOJ ADHHG ADHIR ADHKG ADKNI ADKPE ADRFC ADTPH ADURQ ADYFF ADZKW AEBTG AEFQL AEGNC AEJHL AEJRE AEKMD AEMSY AENEX AEOHA AEPYU AESKC AETCA AEVLU AEXYK AEZWR AFBBN AFDZB AFGCZ AFHIU AFKRA AFLOW AFOHR AFQWF AFWTZ AFZKB AGAYW AGDGC AGJBK AGMZJ AGQEE AGQMX AGQPQ AGRTI AGWZB AGYKE AHAVH AHBYD AHKAY AHPBZ AHSBF AHWEU AHYZX AIAKS AIGIU AIIXL AILAN AITGF AIXLP AJBLW AJRNO AJZVZ ALFXC ALMA_UNASSIGNED_HOLDINGS AMKLP AMXSW AMYLF AMYQR ANMIH AOCGG ASPBG ATHPR AVWKF AXYYD AYFIA AYJHY AZFZN BA0 BENPR BGLVJ CAG CCPQU CITATION COF CS3 CSCUP D1I DDRTE DNIVK DPUIP DU5 EBLON EBS EIOEI EJD ESBYG FEDTE FERAY FFXSO FIGPU FINBP FNLPD FRRFC FSGXE FYJPI GGCAI GGRSB GJIRD GQ7 H13 HCIFZ HF~ HG6 HMJXF HRMNR HVGLF HZB HZ~ I0C IKXTQ IWAJR IXC IXD I~X J-C J0Z JBSCW JZLTJ KB. KOV KVFHK LLZTM MA- MZR N2Q NDZJH NPVJJ NQJWS O9- O93 O9G O9I O9J P19 P2P P9N PDBOC PHGZM PHGZT PT4 PT5 Q2X R89 R9I RLLFE ROL RSV S1Z S26 S27 S28 S3B SCLPG SCM SDH SHX SISQX SJYHP SNE SNPRN SNX SOHCF SOJ SPISZ SRMVM SSLCW STPWE T13 T16 TSG U2A UG4 UOJIU UTJUX UZXMN VC2 VFIZW W48 W4F WK8 Z45 ZMTXR ZZE ~A9 7SR 8BQ 8FD ABRTQ DWQXO JG9 PKEHL PQEST PQGLB PQQKQ PQUKI PRINS 7SE PUEGO -EM AABYN AAFGU AAGCJ AAPBV AAUCO AAYFA ABFGW ABKAS ACBMV ACBRV ACBYP ACIGE ACIPQ ACTTH ACVWB ACWMK ACYCR ADINQ ADMDM ADOXG AEEQQ AEFTE AESTI AEVTX AFNRJ AGGBP AIMYW AJDOV AJGSW AKQUC GQ6 SQXTU Z5O Z7R Z7S Z7V Z7X Z7Y Z7Z Z83 Z85 Z88 |
| ID | FETCH-LOGICAL-c354t-3575cff2672ccfdba856f72815cccfc914f056d8bb4acf741e030057564e29223 |
| IEDL.DBID | 8FG |
| ISSN | 1598-9623 |
| IngestDate | Tue Nov 21 21:26:40 EST 2023 Fri Sep 05 01:32:22 EDT 2025 Thu Sep 04 22:43:36 EDT 2025 Fri Jul 25 11:09:59 EDT 2025 Tue Jul 01 01:15:13 EDT 2025 Thu Apr 24 22:57:32 EDT 2025 |
| IsPeerReviewed | true |
| IsScholarly | true |
| Issue | 2 |
| Language | English |
| License | http://www.springer.com/tdm |
| LinkModel | DirectLink |
| MergedId | FETCHMERGED-LOGICAL-c354t-3575cff2672ccfdba856f72815cccfc914f056d8bb4acf741e030057564e29223 |
| Notes | SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 14 ObjectType-Article-2 content type line 23 G704-000797.2007.13.2.012 |
| PQID | 883380756 |
| PQPubID | 23500 |
| PageCount | 9 |
| ParticipantIDs | nrf_kci_oai_kci_go_kr_ARTI_706085 proquest_miscellaneous_919944333 proquest_miscellaneous_29990543 proquest_journals_883380756 crossref_citationtrail_10_1007_BF03027563 crossref_primary_10_1007_BF03027563 |
| ProviderPackageCode | CITATION AAYXX |
| PublicationCentury | 2000 |
| PublicationDate | 2007-04-01 |
| PublicationDateYYYYMMDD | 2007-04-01 |
| PublicationDate_xml | – month: 04 year: 2007 text: 2007-04-01 day: 01 |
| PublicationDecade | 2000 |
| PublicationPlace | Seoul |
| PublicationPlace_xml | – name: Seoul |
| PublicationTitle | Metals and materials international |
| PublicationYear | 2007 |
| Publisher | Springer Nature B.V 대한금속·재료학회 |
| Publisher_xml | – name: Springer Nature B.V – name: 대한금속·재료학회 |
| References | P. T. Vianco (BF03027563_CR1) 1999; 78 R. Gehman (BF03027563_CR2) 1983; 6 BF03027563_CR8 BF03027563_CR10 D. Q. Yu (BF03027563_CR5) 2006; 17 BF03027563_CR12 A. J. Bard (BF03027563_CR17) 1985 G. Harsanyi (BF03027563_CR4) 1995; 18 BF03027563_CR14 BF03027563_CR13 W. J. Ready (BF03027563_CR6) 1999; 28 G. T. Kohman (BF03027563_CR3) 1955; 24 G. S. Frankel (BF03027563_CR16) 1995 S. J. Krumbein (BF03027563_CR9) 1988; 11 S. B. Lee (BF03027563_CR11) 2006; 504 M. Pecht (BF03027563_CR15) 1990; 13 BF03027563_CR18 W. J. Ready (BF03027563_CR7) 2000; 23 M. Pourbaix (BF03027563_CR19) 1974 |
| References_xml | – volume: 24 start-page: 1115 year: 1955 ident: BF03027563_CR3 publication-title: Bell System Technical Journal doi: 10.1002/j.1538-7305.1955.tb03793.x – volume-title: Standard Potentials in Aqueous Solution year: 1985 ident: BF03027563_CR17 – ident: BF03027563_CR18 – ident: BF03027563_CR13 – volume: 78 start-page: 39 year: 1999 ident: BF03027563_CR1 publication-title: Welding Journal – ident: BF03027563_CR14 – volume: 23 start-page: 285 year: 2000 ident: BF03027563_CR7 publication-title: IEEE Transaction on Advanced Packaging doi: 10.1109/6040.846647 – volume: 11 start-page: 5 year: 1988 ident: BF03027563_CR9 publication-title: IEEE Trans. Comp. Hybrids Manufact. Technol. doi: 10.1109/33.2957 – ident: BF03027563_CR12 – ident: BF03027563_CR10 – ident: BF03027563_CR8 – volume: 17 start-page: 219 year: 2006 ident: BF03027563_CR5 publication-title: J. Mater. Sci.: Mater. Electron. – volume: 28 start-page: 1158 year: 1999 ident: BF03027563_CR6 publication-title: J. Electron. Mater. doi: 10.1007/s11664-999-0151-6 – volume-title: Corrosion Technology year: 1995 ident: BF03027563_CR16 – volume: 504 start-page: 294 year: 2006 ident: BF03027563_CR11 publication-title: Thin Solid Films doi: 10.1016/j.tsf.2005.09.022 – volume: 6 start-page: 239 year: 1983 ident: BF03027563_CR2 publication-title: Int. J. Hybrid Microelect. – volume-title: Atlas of Electrochemical Equilibria in Aqueous Solution year: 1974 ident: BF03027563_CR19 – volume: 18 start-page: 602 year: 1995 ident: BF03027563_CR4 publication-title: IEEE Trans. Comp., Package, Manuf. Technol. A doi: 10.1109/95.465159 – volume: 13 start-page: 383 year: 1990 ident: BF03027563_CR15 publication-title: IEEE transactions on components, hybrids and manufacturing technology doi: 10.1109/33.56172 |
| SSID | ssj0061312 |
| Score | 1.8378125 |
| Snippet | Electrochemical migration is caused by the adsorption of water and the bias voltages between the electrodes or pads which form an electric circuit or in the... KCI Citation Count: 13 |
| SourceID | nrf proquest crossref |
| SourceType | Open Website Aggregation Database Enrichment Source Index Database |
| StartPage | 129 |
| SubjectTerms | Alloys Current density Electric potential Electrodes Electronics Failure Lead (metal) Metallurgy Migration Solders 재료공학 |
| Title | Influence of corrosion properties on electrochemical migration susceptibility of SnPb solders for PCBs |
| URI | https://www.proquest.com/docview/883380756 https://www.proquest.com/docview/29990543 https://www.proquest.com/docview/919944333 https://www.kci.go.kr/kciportal/ci/sereArticleSearch/ciSereArtiView.kci?sereArticleSearchBean.artiId=ART001071586 |
| Volume | 13 |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| ispartofPNX | Metals and Materials International, 2007, 13(2), , pp.129-137 |
| link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1JS8QwFH64XPQgrjiuEb14KNpJ0jYnUXFcQBlcwFto02YQtR2nMwf_ve-16ai4nEpoSOCtX5PX7wHsKZMcWiK6VVZKT3AbeFGUJJ5MjEIH4TI19KPw9U1w8SCuHuWjq80pXVllExOrQJ0Whs7ID6gpLhHnBkf9N4-aRtHlquugMQnTPiYaMvOoc94EYkxU9WWnVOjTmOa_s5NWF3YB_5aPJvOB_RGUq0zTmYc5BxHZca3TBZjI8kWY_UIcuAT2suktwgrL8AMS10YBsz4drQ-II5XhyLW4MY4TgL0-9Wp9s3JUVuUsVWXsO61xl3cThnZIdc0MgSzrnp6Uy_DQObs_vfBcxwTPcCmGHkfwZaxtB2HbGJsmcSQDG7YjXxocG-ULi4AnRWWI2FgEE9kh0dWjHETWVogUVmAqL_JsFVio_DjkSvhpbIQVYZQqm-K3iApSkUR-3IL9Rm7aODpx6mrxohsi5E8Zt2B3PLdfk2j8OmsHxa-fzZMmzmt69gr9PNCI7C81sfxEsgXrjXK0c7ZSj02jBdvjt-gldPUR51kxKjUmXYXgFPdgf8xQRJIsOOdr_26xDjP16S7V7mzA1HAwyjYRlgyTrcr4tmD65Oyme_sBYSvi4Q |
| linkProvider | ProQuest |
| linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwtV1LT9wwEB7R5dByQPQlluXhqu2hh6ib2E7iQ4V4arfAatWCxM0kTozQQrJsdoX4Uf2PzOSxFPVx4xRZsWxrPJ6HZ_wNwCdl4q4loFtlpXQEt74ThnHsyNgoPCBcJoYeCp8M_N6Z-H4uzxfgV_MWhtIqG5lYCuokN3RH_pWK4hJwrr89vnWoaBQFV5sKGhVXHKX3d-ixFd_6-7i9nz3v8OB0r-fURQUcw6WYOhztE2Ot5weeMTaJo1D6NvBCVxpsG-UKizZBgusVkbGob9MuIbrjxCL1lEc4ByjxFwU9aG3B4u7BYPijEf2oGqvwqlQoRdCweIqHWoYIff5EA77IJvYPNVDqtsMVWK6NUrZTcdFrWEizN7D0G1ThW7D9ppoJyy1DlxXHxi1lY7rMnxAqK8NWXVTH1CgE7ObqsuIwVsyKMoGmzMW9pzF-ZsOYIedTJjVD05kN93aLd3D2LOR8D60sz9JVYIFyo4Ar4SaREVYEYaJsgt6P8hMRh27Uhi8N3bSpAcypjsa1bqCXH2ncho_zvuMKtuOvvT4g-fXIXGlC2abvZa5HE42-RF8TrlAo29BpNkfXx7vQc2Zsw9b8L55LCrZEWZrPCo1qXqE5jHOwf_RQBMssOOdr_51iC172Tk-O9XF_cNSBV9XdMmUOrUNrOpmlG2gUTePNmhUZXDw39z8AXUMfdw |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Influence+of+corrosion+properties+on+electrochemical+migration+susceptibility+of+SnPb+solders+for+PCBs&rft.jtitle=Metals+and+materials+international&rft.au=Yoo%2C+Y+R&rft.au=Kim%2C+Y+S&rft.date=2007-04-01&rft.pub=Springer+Nature+B.V&rft.issn=1598-9623&rft.eissn=2005-4149&rft.volume=13&rft.issue=2&rft.spage=129&rft_id=info:doi/10.1007%2FBF03027563&rft.externalDocID=2425044841 |
| thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=1598-9623&client=summon |
| thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=1598-9623&client=summon |
| thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=1598-9623&client=summon |