Fatigue Life Prediction Criterion for Micro-Nanoscale Single-Crystal Silicon Structures
This paper describes fatigue damage evaluation for micro-nanoscale single-crystal silicon (SCS) structures toward the reliable design of microelectromechanical systems subjected to fluctuating stresses. The fatigue tests, by using atomic force microscope (AFM), nanoindentation tester, and specially...
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Published in | Journal of microelectromechanical systems Vol. 18; no. 1; pp. 129 - 137 |
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Main Authors | , |
Format | Journal Article |
Language | English |
Published |
New York, NY
IEEE
01.02.2009
Institute of Electrical and Electronics Engineers The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
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Abstract | This paper describes fatigue damage evaluation for micro-nanoscale single-crystal silicon (SCS) structures toward the reliable design of microelectromechanical systems subjected to fluctuating stresses. The fatigue tests, by using atomic force microscope (AFM), nanoindentation tester, and specially developed uniaxial tensile tester, have been conducted under tensile and bending deformation modes for investigating the effects of specimen size, frequency, temperature, and deformation mode on the fatigue life of SCS specimens. Regardless of frequency and temperature, the fatigue life has correlated with specimen size. For example, nanoscale SCS specimens with 200 nm in width and 255 nm in thickness have showed a larger number of cycles to failure, by a factor of 10 5 , at the same stress level, as compared to microscale specimens with 48 ¿m in width and 19 ¿m in thickness. Deformation mode has also affected the lifetime; however, no frequency and temperature dependences have been observed unambiguously in the S - N curves. The stress ratio parameter corresponding to the ratio of peak stress to average fracture strength has enabled us to estimate the lifetime for each deformation mode. To predict the fatigue life of SCS structures regardless of deformation mode and specimen size, we have proposed an empirical parameter that includes the resolved shear stress. The mechanism of fatigue failure of SCS structures is discussed from the viewpoint of dislocation slip, crack nucleation, growth, and failure through observations using AFM and scanning electron microscope. |
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AbstractList | This paper describes fatigue damage evaluation for micro-nanoscale single-crystal silicon (SCS) structures toward the reliable design of microelectromechanical systems subjected to fluctuating stresses. The fatigue tests, by using atomic force microscope (AFM), nanoindentation tester, and specially developed uniaxial tensile tester, have been conducted under tensile and bending deformation modes for investigating the effects of specimen size, frequency, temperature, and deformation mode on the fatigue life of SCS specimens. Regardless of frequency and temperature, the fatigue life has correlated with specimen size. For example, nanoscale SCS specimens with 200 nm in width and 255 nm in thickness have showed a larger number of cycles to failure, by a factor of 10 5 , at the same stress level, as compared to microscale specimens with 48 ¿m in width and 19 ¿m in thickness. Deformation mode has also affected the lifetime; however, no frequency and temperature dependences have been observed unambiguously in the S - N curves. The stress ratio parameter corresponding to the ratio of peak stress to average fracture strength has enabled us to estimate the lifetime for each deformation mode. To predict the fatigue life of SCS structures regardless of deformation mode and specimen size, we have proposed an empirical parameter that includes the resolved shear stress. The mechanism of fatigue failure of SCS structures is discussed from the viewpoint of dislocation slip, crack nucleation, growth, and failure through observations using AFM and scanning electron microscope. The fatigue tests, by using atomic force microscope (AFM), nanoindentation tester, and specially developed uniaxial tensile tester, have been conducted under tensile and bending deformation modes for investigating the effects of specimen size, frequency, temperature, and deformation mode on the fatigue life of SCS specimens. This paper describes fatigue damage evaluation for micro-nanoscale single-crystal silicon (SCS) structures toward the reliable design of microelectromechanical systems subjected to fluctuating stresses. The fatigue tests, by using atomic force microscope (AFM), nanoindentation tester, and specially developed uniaxial tensile tester, have been conducted under tensile and bending deformation modes for investigating the effects of specimen size, frequency, temperature, and deformation mode on the fatigue life of SCS specimens. Regardless of frequency and temperature, the fatigue life has correlated with specimen size. For example, nanoscale SCS specimens with 200 nm in width and 255 nm in thickness have showed a larger number of cycles to failure, by a factor of 10 super(5), at the same stress level, as compared to microscale specimens with 48 mum in width and 19 mum in thickness. Deformation mode has also affected the lifetime; however, no frequency and temperature dependences have been observed unambiguously in the S-N curves. The stress ratio parameter corresponding to the ratio of peak stress to average fracture strength has enabled us to estimate the lifetime for each deformation mode. To predict the fatigue life of SCS structures regardless of deformation mode and specimen size, we have proposed an empirical parameter that includes the resolved shear stress. The mechanism of fatigue failure of SCS structures is discussed from the viewpoint of dislocation slip, crack nucleation, growth, and failure through observations using AFM and scanning electron microscope. |
Author | Isono, Y. Namazu, T. |
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Cites_doi | 10.1002/sia.2820 10.1098/rspa.1999.0478 10.1103/PhysRevB.68.205204 10.1016/S0924-4247(01)00623-9 10.1016/S1359-6462(01)01159-9 10.1016/S0924-4247(02)00328-X 10.1080/14786430600764898 10.1109/MEMSYS.2008.4443685 10.1016/j.msea.2005.03.053 10.1016/S0924-4247(01)00709-9 10.1126/science.256.5063.1537 10.1109/84.993447 10.1109/MEMSYS.2008.4443686 10.1007/s005420050137 10.1016/S0921-5093(96)10558-X 10.1002/pssa.200460543 10.1109/JMEMS.2005.859196 10.1063/1.2801390 10.1007/BF02322482 10.4028/www.scientific.net/KEM.297-300.567 10.1109/SENSOR.2005.1496384 10.1109/16.848302 10.1541/ieejsmas.125.374 10.1109/84.896765 10.1109/84.967383 10.1016/S0924-4247(02)00431-4 |
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Keywords | fatigue fatigue life prediction durability reliability resolved shear stress Atomic force microscope (AFM) single-crystal silicon (SCS) size effect Atomic force microscopy Nanostructures Fatigue fracture Size effect Silicon Damage Microelectromechanical device Crystal structure Nanohardness Fatigue life Temperature dependence Scanning electron microscopy Fatigue testing Nanoindentation Durability Fatigue Indentation Microhardness Monocrystals Nanotechnology |
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References | ref13 ref12 ref15 ref14 bagdahn (ref1) 2003; 103 ref32 ref10 namazu (ref3) 2003 namazu (ref23) 2003; 104 roark (ref21) 1965 ref17 ref16 ref19 ref18 saka (ref24) 2007; 86 isono (ref30) 2001 ref26 ref25 ref20 ref22 connally (ref8) 1992; 256 ref28 ref27 ref7 ando (ref2) 2001; 93 ref9 namazu (ref4) 2004 isono (ref31) 2001 ref6 ref5 muhlstein (ref11) 2001; 94 isono (ref29) 2001 |
References_xml | – start-page: 135 year: 2001 ident: ref29 article-title: afm bending testing of nanometric single crystal silicon wire at intermediate temperatures for mems publication-title: Proc 14th IEEE Int Conf MEMS contributor: fullname: isono – ident: ref5 doi: 10.1002/sia.2820 – ident: ref15 doi: 10.1098/rspa.1999.0478 – ident: ref28 doi: 10.1103/PhysRevB.68.205204 – volume: 93 start-page: 70 year: 2001 ident: ref2 article-title: tensile-mode fatigue testing of silicon films as structural materials for mems publication-title: Sens Actuators A Phys doi: 10.1016/S0924-4247(01)00623-9 contributor: fullname: ando – ident: ref25 doi: 10.1016/S1359-6462(01)01159-9 – volume: 103 start-page: 9 year: 2003 ident: ref1 article-title: fatigue of polycrystalline silicon under long-term cyclic loading publication-title: Sens Actuators A Phys doi: 10.1016/S0924-4247(02)00328-X contributor: fullname: bagdahn – volume: 86 start-page: 4841 year: 2007 ident: ref24 article-title: in-situ tem observation of transformation of dislocations from shuffle to glide sets in si under supersaturation of interstitials publication-title: Philos Mag doi: 10.1080/14786430600764898 contributor: fullname: saka – ident: ref14 doi: 10.1109/MEMSYS.2008.4443685 – ident: ref27 doi: 10.1016/j.msea.2005.03.053 – volume: 94 start-page: 177 year: 2001 ident: ref11 article-title: high-cycle fatigue and durability of polycrystalline silicon thin films in ambient air publication-title: Sens Actuators A Phys doi: 10.1016/S0924-4247(01)00709-9 contributor: fullname: muhlstein – volume: 256 start-page: 1537 year: 1992 ident: ref8 article-title: slow crack growth in single-crystal silicon publication-title: Science doi: 10.1126/science.256.5063.1537 contributor: fullname: connally – ident: ref22 doi: 10.1109/84.993447 – ident: ref12 doi: 10.1109/MEMSYS.2008.4443686 – ident: ref7 doi: 10.1007/s005420050137 – ident: ref20 doi: 10.1016/S0921-5093(96)10558-X – start-page: 149 year: 2004 ident: ref4 article-title: high-cycle fatigue damage evaluation for micro-nanoscale single crystal silicon under bending and tensile stressing publication-title: Proc 17th IEEE Int Conf Microelectromech Syst contributor: fullname: namazu – ident: ref26 doi: 10.1002/pssa.200460543 – ident: ref32 doi: 10.1109/JMEMS.2005.859196 – start-page: 662 year: 2003 ident: ref3 article-title: high-cycle fatigue test of nanoscale si and wires based on afm technique publication-title: Proc 16th IEEE Int Conf Microelectromech Syst contributor: fullname: namazu – ident: ref13 doi: 10.1063/1.2801390 – ident: ref9 doi: 10.1007/BF02322482 – start-page: 213 year: 2001 ident: ref30 article-title: size effect on mechanical properties of nano-scale single crystal silicon at elevated temperatures publication-title: Proc ISMS 21st Century contributor: fullname: isono – ident: ref6 doi: 10.4028/www.scientific.net/KEM.297-300.567 – ident: ref17 doi: 10.1109/SENSOR.2005.1496384 – start-page: 112 year: 1965 ident: ref21 publication-title: Formulas for Stress and Strain contributor: fullname: roark – ident: ref16 doi: 10.1109/16.848302 – ident: ref19 doi: 10.1541/ieejsmas.125.374 – ident: ref18 doi: 10.1109/84.896765 – start-page: 87 year: 2001 ident: ref31 article-title: plastic behavior of nano-scale single crystal silicon at intermediate temperatures for mems publication-title: Proc 10th ICF contributor: fullname: isono – ident: ref10 doi: 10.1109/84.967383 – volume: 104 start-page: 78 year: 2003 ident: ref23 article-title: quasi-static bending test of nano-scale wire at intermediate temperatures using afm-based technique publication-title: Sens Actuators A Phys doi: 10.1016/S0924-4247(02)00431-4 contributor: fullname: namazu |
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Snippet | This paper describes fatigue damage evaluation for micro-nanoscale single-crystal silicon (SCS) structures toward the reliable design of microelectromechanical... The fatigue tests, by using atomic force microscope (AFM), nanoindentation tester, and specially developed uniaxial tensile tester, have been conducted under... |
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SubjectTerms | Atomic force microscope (AFM) Atomic force microscopy Atomic structure Deformation durability Exact sciences and technology Fatigue Fatigue failure Fatigue life fatigue life prediction Frequency Instruments, apparatus, components and techniques common to several branches of physics and astronomy Life estimation Life testing Lifetime estimation Mechanical instruments, equipment and techniques Metallurgy Microelectromechanical systems Micromechanical devices and systems Nanostructure Physics reliability resolved shear stress Scanning electron microscopy Silicon Single crystals single-crystal silicon (SCS) size effect Stress Stresses Temperature dependence Tensile stress |
Title | Fatigue Life Prediction Criterion for Micro-Nanoscale Single-Crystal Silicon Structures |
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