The application of an analytical model to solve an inverse heat conduction problem: Transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates

• Published in: Journal of manufacturing processes Vol. 48; pp. 164 - 173
• Main Authors: Curtulo, Joanisa P., Dias, Marcelino, Bertelli, Felipe, Silva, Bismarck L., Spinelli, José E., Garcia, Amauri, Cheung, Noé
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01.12.2019
• Subjects: Analytical model; Heat transfer; Interface; Peritectic; Sn-Sb alloy; Solidification; Wettability; Analytical model; Wettability; Sn-Sb alloy; Heat transfer; Interface; Peritectic; Solidification

[Display omitted] •A thermal/experimental approach is proposed to analyze solder/substrates interaction.•A Sn-Sb solder solidified against three substrates gives experimental support to the approach.•Wettability is shown not to be the only important parameter for solder/substrate interaction.•A ther...