APA (7th ed.) Citation

Curtulo, J. P., Dias, M., Bertelli, F., Silva, B. L., Spinelli, J. E., Garcia, A., & Cheung, N. (2019). The application of an analytical model to solve an inverse heat conduction problem: Transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates. Journal of manufacturing processes, 48, 164-173. https://doi.org/10.1016/j.jmapro.2019.10.029

Chicago Style (17th ed.) Citation

Curtulo, Joanisa P., Marcelino Dias, Felipe Bertelli, Bismarck L. Silva, José E. Spinelli, Amauri Garcia, and Noé Cheung. "The Application of an Analytical Model to Solve an Inverse Heat Conduction Problem: Transient Solidification of a Sn-Sb Peritectic Solder Alloy on Distinct Substrates." Journal of Manufacturing Processes 48 (2019): 164-173. https://doi.org/10.1016/j.jmapro.2019.10.029.

MLA (9th ed.) Citation

Curtulo, Joanisa P., et al. "The Application of an Analytical Model to Solve an Inverse Heat Conduction Problem: Transient Solidification of a Sn-Sb Peritectic Solder Alloy on Distinct Substrates." Journal of Manufacturing Processes, vol. 48, 2019, pp. 164-173, https://doi.org/10.1016/j.jmapro.2019.10.029.