APA (7th ed.) Citation

Park, I., & Park, J. (2023). Scalable Scheduling of Semiconductor Packaging Facilities Using Deep Reinforcement Learning. IEEE transactions on cybernetics, 53(6), 3518-3531. https://doi.org/10.1109/TCYB.2021.3128075

Chicago Style (17th ed.) Citation

Park, In-Beom, and Jonghun Park. "Scalable Scheduling of Semiconductor Packaging Facilities Using Deep Reinforcement Learning." IEEE Transactions on Cybernetics 53, no. 6 (2023): 3518-3531. https://doi.org/10.1109/TCYB.2021.3128075.

MLA (9th ed.) Citation

Park, In-Beom, and Jonghun Park. "Scalable Scheduling of Semiconductor Packaging Facilities Using Deep Reinforcement Learning." IEEE Transactions on Cybernetics, vol. 53, no. 6, 2023, pp. 3518-3531, https://doi.org/10.1109/TCYB.2021.3128075.