Fabrication and characterization of highly thermal conductive Si3N4/diamond composite materials

• Published in: Materials & design Vol. 225; p. 111482
• Main Authors: Wu, Dandan, Wang, Chengyong, Hu, Xiaoyue, Chen, Wanglin
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01.01.2023; Elsevier
• Subjects: Chemical bonding interface; Diamond particle; Multilayer structure; Silicon nitride; Thermal conductivity; Thermal conductivity; Diamond particle; Chemical bonding interface; Multilayer structure; Silicon nitride

[Display omitted] •High-thermal-conductivity composites with silicon nitride (Si3N4) as the matrix and diamond particles as the reinforcing phase were successfully developed.•Si3N4/diamond composites offered maximum thermal conductivity of 201.96 W·m−1·K−1, an increase of 272.87 % compared with Si3N...