Residual stresses in multi-crystalline silicon photovoltaic wafers due to casting and wire sawing

• Published in: Materials science in semiconductor processing Vol. 75; pp. 173 - 182
• Main Authors: Pogue, V., Melkote, S.N., Danyluk, S.
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01.03.2018
• Subjects: Casting; Multicrystalline; Raman; Residual stress; Silicon; Wire-sawing; Casting; Silicon; Raman; Wire-sawing; Residual stress; Multicrystalline

A significant portion of the total manufacturing cost of crystalline silicon solar cells is attributed to the manufacturing and material costs of the silicon wafer. In addition to its high cost, silicon is very brittle, therefore wafers are prone to fracture during handling and processing. In this p...