Residual stresses in multi-crystalline silicon photovoltaic wafers due to casting and wire sawing
A significant portion of the total manufacturing cost of crystalline silicon solar cells is attributed to the manufacturing and material costs of the silicon wafer. In addition to its high cost, silicon is very brittle, therefore wafers are prone to fracture during handling and processing. In this p...
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Published in | Materials science in semiconductor processing Vol. 75; pp. 173 - 182 |
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Language | English |
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Abstract | A significant portion of the total manufacturing cost of crystalline silicon solar cells is attributed to the manufacturing and material costs of the silicon wafer. In addition to its high cost, silicon is very brittle, therefore wafers are prone to fracture during handling and processing. In this paper we investigate the manufacturing-induced residual stresses in photovoltaic silicon wafers due to casting and wire-sawing processes which affect the mechanical integrity of the wafers. Specifically, the paper addresses measurement of residual stresses in multi-crystalline silicon (mc-Si) wafers by photoelasticity and polarized micro-Raman spectroscopy methods, as well as the effects of diamond wire sawing and loose abrasive slurry sawing on the residual stresses within the grains and at the grain boundaries. The micro-Raman method probes the residual stresses in the near-surface of the wafer while the photoelasticity technique probes the through-thickness residual stress in the wafers. The results show that diamond wire sawing and loose abrasive slurry wire sawing produce compressive residual stresses in the as-cut mc-Si wafer surface. Loose abrasive slurry wire sawing produces larger compressive stresses in the as-cut surface layers compared to diamond wire sawing. Beneath the saw damage layer in the sawn wafers, low residual tensile stresses are present from the casting process. |
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AbstractList | A significant portion of the total manufacturing cost of crystalline silicon solar cells is attributed to the manufacturing and material costs of the silicon wafer. In addition to its high cost, silicon is very brittle, therefore wafers are prone to fracture during handling and processing. In this paper we investigate the manufacturing-induced residual stresses in photovoltaic silicon wafers due to casting and wire-sawing processes which affect the mechanical integrity of the wafers. Specifically, the paper addresses measurement of residual stresses in multi-crystalline silicon (mc-Si) wafers by photoelasticity and polarized micro-Raman spectroscopy methods, as well as the effects of diamond wire sawing and loose abrasive slurry sawing on the residual stresses within the grains and at the grain boundaries. The micro-Raman method probes the residual stresses in the near-surface of the wafer while the photoelasticity technique probes the through-thickness residual stress in the wafers. The results show that diamond wire sawing and loose abrasive slurry wire sawing produce compressive residual stresses in the as-cut mc-Si wafer surface. Loose abrasive slurry wire sawing produces larger compressive stresses in the as-cut surface layers compared to diamond wire sawing. Beneath the saw damage layer in the sawn wafers, low residual tensile stresses are present from the casting process. |
Author | Danyluk, S. Pogue, V. Melkote, S.N. |
Author_xml | – sequence: 1 givenname: V. surname: Pogue fullname: Pogue, V. email: vpogues@gmail.com – sequence: 2 givenname: S.N. surname: Melkote fullname: Melkote, S.N. – sequence: 3 givenname: S. surname: Danyluk fullname: Danyluk, S. |
BookMark | eNp9kM9KAzEQh4Mo2FZfwFNeYNfM7nZ3A16k-A8Kgug5pMlEU7bZkklb-vam1LOnmeHHN8x8U3YZxoCM3YEoQUB7vy43RNuyEtCVAKUQ8oJNoO_qohE9XOa-bmXRCwHXbEq0FkLMK2gnTH8gebvTA6cUkQiJ-8A3uyH5wsQjJT0MPiAnP3gzBr79GdO4H4ekveEH7TAStzvkaeRGU_Lhm-tg-cHHzOhDnm_YldMD4e1fnbGv56fPxWuxfH95WzwuC1M3TSpghbWEttai7ft518oKZE4612GFgG3nqqo30tq5FiuQaFpnXW2lmBvtVnVTz1h13mviSBTRqW30Gx2PCoQ6SVJrdZKkTpIUgMqSMvRwhjBftvcYFRmPwaDND5ik7Oj_w38BWNh0ug |
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ContentType | Journal Article |
Copyright | 2017 Elsevier Ltd |
Copyright_xml | – notice: 2017 Elsevier Ltd |
DBID | AAYXX CITATION |
DOI | 10.1016/j.mssp.2017.11.009 |
DatabaseName | CrossRef |
DatabaseTitle | CrossRef |
DatabaseTitleList | |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Engineering |
EISSN | 1873-4081 |
EndPage | 182 |
ExternalDocumentID | 10_1016_j_mssp_2017_11_009 S1369800117315688 |
GroupedDBID | --M -~X .DC .~1 0R~ 1B1 1~. 1~5 4.4 457 4G. 5GY 5VS 7-5 71M 8P~ AABXZ AACTN AAEDT AAEDW AAEPC AAIAV AAIKJ AAKOC AALRI AAOAW AAQFI AAXUO ABFRF ABJNI ABMAC ABXRA ABYKQ ACBEA ACDAQ ACGFO ACGFS ACRLP ADBBV ADEZE ADTZH AEBSH AECPX AEFWE AEKER AENEX AEZYN AFKWA AFRZQ AFTJW AGHFR AGUBO AGYEJ AHJVU AIEXJ AIKHN AITUG AJBFU AJOXV ALMA_UNASSIGNED_HOLDINGS AMFUW AMRAJ AXJTR BJAXD BKOJK BLXMC CS3 DU5 EBS EFJIC EFLBG EJD EO8 EO9 EP2 EP3 FDB FEDTE FIRID FNPLU FYGXN G-Q GBLVA HVGLF J1W JJJVA KOM M41 MAGPM MO0 N9A O-L O9- OAUVE P-8 P-9 P2P PC. Q38 RIG ROL RPZ SDF SDG SDP SES SPC SPCBC SSM SST SSZ T5K UNMZH XPP ZMT ~G- --K 29M AAQXK AAXKI AAYXX ABXDB ACNNM ADMUD AFFNX AFJKZ AKRWK ASPBG AVWKF AZFZN CITATION FGOYB HZ~ IHE OZT R2- SEW |
ID | FETCH-LOGICAL-c344t-1be39163a06885769219c347f7e2e1e67f228c9dd5a0b19ec6fdf3d905cafb343 |
IEDL.DBID | AIKHN |
ISSN | 1369-8001 |
IngestDate | Thu Sep 26 16:10:09 EDT 2024 Fri Feb 23 02:19:11 EST 2024 |
IsDoiOpenAccess | false |
IsOpenAccess | true |
IsPeerReviewed | true |
IsScholarly | true |
Keywords | Casting Silicon Raman Wire-sawing Residual stress Multicrystalline |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-LOGICAL-c344t-1be39163a06885769219c347f7e2e1e67f228c9dd5a0b19ec6fdf3d905cafb343 |
OpenAccessLink | http://manuscript.elsevier.com/S1369800117315688/pdf/S1369800117315688.pdf |
PageCount | 10 |
ParticipantIDs | crossref_primary_10_1016_j_mssp_2017_11_009 elsevier_sciencedirect_doi_10_1016_j_mssp_2017_11_009 |
PublicationCentury | 2000 |
PublicationDate | 2018-03-01 2018-03-00 |
PublicationDateYYYYMMDD | 2018-03-01 |
PublicationDate_xml | – month: 03 year: 2018 text: 2018-03-01 day: 01 |
PublicationDecade | 2010 |
PublicationTitle | Materials science in semiconductor processing |
PublicationYear | 2018 |
Publisher | Elsevier Ltd |
Publisher_xml | – name: Elsevier Ltd |
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SSID | ssj0005216 |
Score | 2.2749767 |
Snippet | A significant portion of the total manufacturing cost of crystalline silicon solar cells is attributed to the manufacturing and material costs of the silicon... |
SourceID | crossref elsevier |
SourceType | Aggregation Database Publisher |
StartPage | 173 |
SubjectTerms | Casting Multicrystalline Raman Residual stress Silicon Wire-sawing |
Title | Residual stresses in multi-crystalline silicon photovoltaic wafers due to casting and wire sawing |
URI | https://dx.doi.org/10.1016/j.mssp.2017.11.009 |
Volume | 75 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwnV1LS8NAEB5qe9GD-MT6KHvwJts2m908jqVYqoUeqsXewm6ywYgmpUkpXvztziYpVBAPnsImOyHMhm9m4JtvAG5dxVkUu4JKxH7Kha-ocqWmTAnm6tCL_Ertc-qM5_xxIRYNGG57YQytssb-CtNLtK7v9Gpv9pZJ0nuybMf3Sk0zG4sQz9uDFoYjzpvQGjxMxtMdpkc5AdXsp8ag7p2paF4feW5kKy23a8Q8DS_xt_i0E3NGR3BYJ4tkUH3PMTR0egIHOxKCpyBnOi_7qUjV9aFzkqSkpAnScPWJuZ8R3dYkT97xzFOyfM2KDCGpkElINjLG7I9Ea02KjIQyNxxoItOIGAVjkssNrs9gPrp_Ho5pPTaBhjbnBbWUNt20tjTzZLCc8BGU8Ikbu5ppSztuzJgX-lEkZF9Zvg6dOIrtyO-LUMbK5vY5NNMs1RdAjLaN7LNYCEdx3KwYQxsH34Npm8d4G-62zgqWlTpGsKWNvQXGtYFxLZYZAbq2DWLrz-DHGQcI33_YXf7T7gr2ceVVjLFraBartb7BFKJQHdjrflmd-kcx18nsZfIN8VHIjQ |
link.rule.ids | 315,786,790,4521,24144,27957,27958,45620,45714 |
linkProvider | Elsevier |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwnV1LS8QwEB5096AexCe-zcGbxN2mSdMel0XZdXUPPsBbSdoUK9ou28riv3fSB6wgHjy2yZTyJXyZwDffAFxIzVmcSEEVcj_lItBUS2Uo04JJE_lxULt9Tr3RM799ES8rMGxrYayssuH-mtMrtm7e9Bo0e7M07T06rhf4laeZi5cQ31-FLhfS4R3oDsaT0XRJ6VF1QLXzqQ1oamdqmddHUVjbSkdeWTNPq0v87XxaOnNutmCzSRbJoP6fbVgx2Q5sLFkI7oJ6MEVVT0Xqqg9TkDQjlUyQRvMvzP2s6bYhRfqOa56R2Wte5khJpUojslAJZn8k_jSkzEmkCquBJiqLiXUwJoVa4PMePN9cPw1HtGmbQCOX85I62thqWlfZfjJ4nQiQlHBEJtIw4xhPJoz5URDHQvW1E5jIS-LEjYO-iFSiXe7uQyfLM3MAxHrbqD5LhPA0x8maMYzx8DuYtvmMH8JlC1Y4q90xwlY29hZaaEMLLV4zQoT2EESLZ_hjjUOk7z_ijv4Zdw5ro6f7u_BuPJ0cwzqO-LV67AQ65fzTnGI6UeqzZrt8A4RDyNw |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Residual+stresses+in+multi-crystalline+silicon+photovoltaic+wafers+due+to+casting+and+wire+sawing&rft.jtitle=Materials+science+in+semiconductor+processing&rft.au=Pogue%2C+V.&rft.au=Melkote%2C+S.N.&rft.au=Danyluk%2C+S.&rft.date=2018-03-01&rft.pub=Elsevier+Ltd&rft.issn=1369-8001&rft.eissn=1873-4081&rft.volume=75&rft.spage=173&rft.epage=182&rft_id=info:doi/10.1016%2Fj.mssp.2017.11.009&rft.externalDocID=S1369800117315688 |
thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=1369-8001&client=summon |
thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=1369-8001&client=summon |
thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=1369-8001&client=summon |