Schottky contacts on ultra-high-pressure-annealed GaN with high rectification ratio and near-unity ideality factor
Abstract We investigate the electrical characteristics of Ni Schottky contacts on n-type GaN films that have undergone ultra-high-pressure annealing (UHPA), a key processing step for activating implanted Mg. Contacts deposited on these films exhibit low rectification and high leakage current compare...
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Published in | Applied physics express Vol. 16; no. 3; pp. 31006 - 31009 |
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Main Authors | , , , , , , , , , , , , |
Format | Journal Article |
Language | English |
Published |
United States
IOP Publishing
01.03.2023
Japan Society of Applied Physics |
Subjects | |
Online Access | Get full text |
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Summary: | Abstract
We investigate the electrical characteristics of Ni Schottky contacts on n-type GaN films that have undergone ultra-high-pressure annealing (UHPA), a key processing step for activating implanted Mg. Contacts deposited on these films exhibit low rectification and high leakage current compared to contacts on as-grown films. By employing an optimized surface treatment to restore the GaN surface following UHPA, we obtain Schottky contacts with a high rectification ratio of ∼10
9
, a near-unity ideality factor of 1.03, and a barrier height of ∼0.9 eV. These characteristics enable the development of GaN junction barrier Schottky diodes employing Mg implantation and UHPA. |
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Bibliography: | APEX-107147.R1 AR0000873 USDOE Advanced Research Projects Agency - Energy (ARPA-E) |
ISSN: | 1882-0778 1882-0786 |
DOI: | 10.35848/1882-0786/acc443 |