Effect of low temperature, low water vapor pressure environments on the fatigue behavior of an Al-Li aerospace alloy

•The effects of low water vapor, low temperature environments, on the FCGR of 2199 AA.•FCGR was found to decrease with decreasing water vapor pressure systematically.•Temperature was varied from 23C to −65 °C and only −30 °C and −50 °C effected FCGR.•The proposed reasoning for low temp changes in FC...

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Published inInternational journal of fatigue Vol. 148; p. 106215
Main Authors Brown, Luke B., Jones, Jennifer L., (Warner) Locke, Jenifer S., Burns, James T.
Format Journal Article
LanguageEnglish
Published Kidlington Elsevier Ltd 01.07.2021
Elsevier BV
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Abstract •The effects of low water vapor, low temperature environments, on the FCGR of 2199 AA.•FCGR was found to decrease with decreasing water vapor pressure systematically.•Temperature was varied from 23C to −65 °C and only −30 °C and −50 °C effected FCGR.•The proposed reasoning for low temp changes in FCGR are H-dislocation interactions. The objective of the study is to evaluate the fatigue crack growth of a third-generation Al-Li-Cu alloy (2199-T86) in environments relevant to high-altitude flight. Reduction of PH2O at 23 °C resulted in a general reduction of crack growth rates. A local minimum in growth rates were observed at intermediate ΔK and PH2O and was attributed to roughness induced impedance of water transport through the crack wake. Decreasing temperature had no effect on growth kinetics down to −15 °C, but decreased crack rates were observed at −30 °C and −50 °C.
AbstractList •The effects of low water vapor, low temperature environments, on the FCGR of 2199 AA.•FCGR was found to decrease with decreasing water vapor pressure systematically.•Temperature was varied from 23C to −65 °C and only −30 °C and −50 °C effected FCGR.•The proposed reasoning for low temp changes in FCGR are H-dislocation interactions. The objective of the study is to evaluate the fatigue crack growth of a third-generation Al-Li-Cu alloy (2199-T86) in environments relevant to high-altitude flight. Reduction of PH2O at 23 °C resulted in a general reduction of crack growth rates. A local minimum in growth rates were observed at intermediate ΔK and PH2O and was attributed to roughness induced impedance of water transport through the crack wake. Decreasing temperature had no effect on growth kinetics down to −15 °C, but decreased crack rates were observed at −30 °C and −50 °C.
The objective of the study is to evaluate the fatigue crack growth of a third-generation Al-Li-Cu alloy (2199-T86) in environments relevant to high-altitude flight. Reduction of PH2O at 23 °C resulted in a general reduction of crack growth rates. A local minimum in growth rates were observed at intermediate ΔK and PH2O and was attributed to roughness induced impedance of water transport through the crack wake. Decreasing temperature had no effect on growth kinetics down to −15 °C, but decreased crack rates were observed at −30 °C and −50 °C.
ArticleNumber 106215
Author Jones, Jennifer L.
Brown, Luke B.
(Warner) Locke, Jenifer S.
Burns, James T.
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  surname: Burns
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Keywords Low Temperature
Al-Li alloy
2199 AA
Fatigue Crack Growth
Environmental Cracking
Low water vapor pressure
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Snippet •The effects of low water vapor, low temperature environments, on the FCGR of 2199 AA.•FCGR was found to decrease with decreasing water vapor pressure...
The objective of the study is to evaluate the fatigue crack growth of a third-generation Al-Li-Cu alloy (2199-T86) in environments relevant to high-altitude...
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StartPage 106215
SubjectTerms 2199 AA
Al-Li alloy
Aluminum
Copper
Copper base alloys
Crack propagation
Environmental Cracking
Fatigue Crack Growth
Fatigue failure
Fracture mechanics
High altitude
Low Temperature
Low water vapor pressure
Materials fatigue
Reduction
Vapor pressure
Water vapor
Title Effect of low temperature, low water vapor pressure environments on the fatigue behavior of an Al-Li aerospace alloy
URI https://dx.doi.org/10.1016/j.ijfatigue.2021.106215
https://www.proquest.com/docview/2534643113
Volume 148
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