Microstructural development of hypoeutectic Zn–(10–40)wt%Sn solder alloys and impacts of interphase spacing and macrosegregation pattern on hardness

• Published in: Journal of alloys and compounds Vol. 647; pp. 989 - 996
• Main Authors: Santos, Washington L.R., Brito, Crystopher, Bertelli, Felipe, Spinelli, José E., Garcia, Amauri
• Format: Journal Article
• Language: English
• Published: Elsevier B.V 25.10.2015
• Subjects: Alloys; Hardness; Mathematical analysis; Microstructure; Plates; Solders; Solidification; Zinc; Zinc base alloys; Zn–Sn solders; Microstructure; Hardness; Zn–Sn solders; Solidification

The most relevant range of compositions of Zn–Sn high-temperature solder alloys remains between 10 and 40 wt%Sn. Hence, transient directional solidification experiments have been carried out with Zn–10, 20, 30 and 40wt%Sn alloys under a wide range of cooling rates (T˙) with a view to investigating t...